Cheng Shao-Liang, Chen Ming-Feng
Department of Chemical and Materials Engineering, National Central University, Chung-Li City, Taoyuan County, 32001, Taiwan, Republic of China.
Nanoscale Res Lett. 2012 Feb 13;7(1):119. doi: 10.1186/1556-276X-7-119.
We report here on the first study of the growth kinetics of high-yield, vertical CuO nanowires on silicon substrates produced by the process of thermal oxidation. The length of the CuO nanowires could be tuned from several to tens of micrometers by adjusting the oxidation temperature and time. The grown CuO nanowires were determined to be single-crystalline with different axial crystallographic orientations. After a series of scanning electron microscopy examinations, the average length of CuO nanowires produced at each temperature was found to follow a parabolic relationship with the oxidation time. The parabolic growth rate at different oxidation temperatures was measured. The activation energy for the growth of CuO nanowires calculated from an Arrhenius plot was found to be about 174.2 kJ/mole. In addition, the current-voltage characterization indicated that the sample with high-density CuO nanowires exhibited ohmic behavior, and its resistance was found to significantly decrease with increasing environmental temperature. The result can be attributed to an increase in the number of carriers at higher temperatures.
我们在此报告关于通过热氧化过程在硅衬底上生长高产率垂直氧化铜纳米线的生长动力学的首次研究。通过调整氧化温度和时间,氧化铜纳米线的长度可从几微米调整到几十微米。所生长的氧化铜纳米线被确定为具有不同轴向晶体取向的单晶。经过一系列扫描电子显微镜检查,发现每个温度下产生的氧化铜纳米线的平均长度与氧化时间呈抛物线关系。测量了不同氧化温度下的抛物线生长速率。从阿伦尼乌斯图计算出的氧化铜纳米线生长的活化能约为174.2千焦/摩尔。此外,电流-电压特性表明,具有高密度氧化铜纳米线的样品表现出欧姆行为,并且发现其电阻随着环境温度的升高而显著降低。该结果可归因于较高温度下载流子数量的增加。