College of Chemistry, Sichuan University, Chengdu, China.
Opt Lett. 2012 May 1;37(9):1406-8. doi: 10.1364/OL.37.001406.
A great deal of intensive research has been conducted to obtain high-quality transparent ultralow-refractive-index and ultralow-dielectric-constant thin films for microptics and microelectronics applications. Here, we report a simple procedure to prepare highly porous silica thin films with high optical quality and water resistance through nano-etching of mesoporous silica films followed by fluoroalkylsilane surface modification. The films possess an ultralow refractive index of 1.03 (800 nm) and an ultralow dielectric constant of 1.30 (100 kHz), to our knowledge the lowest values ever reported in thin film materials. The films are superhydrophobic (water contact angle=156 deg), thus exhibit high moisture stability.
大量的密集研究已经进行，以获得高质量的透明超低折射率和超低介电常数的薄膜，用于微光学和微电子学应用。在这里，我们报告了一种简单的方法，通过介孔硅薄膜的纳米蚀刻，然后进行氟烷基硅烷表面改性，制备具有高光学质量和耐水性的高多孔硅薄膜。该薄膜具有超低的折射率 1.03（800nm）和超低的介电常数 1.30（100kHz），据我们所知，这是薄膜材料中报道的最低值。该薄膜具有超疏水性（水接触角=156°），因此表现出高的水分稳定性。
