Department of Chemistry and §Department of Chemical Engineering and Material Science, University of Minnesota , Minneapolis, Minnesota 55455, United States.
ACS Appl Mater Interfaces. 2012 Jul 25;4(7):3550-7. doi: 10.1021/am300603x. Epub 2012 Jul 3.
Nanoscopic ring arrays of various materials show promise for both technological applications and fundamental studies. In this work we report the preparation of sub-50 nm diameter ring arrays from metallic thin films using a block polymer lithographic pattern transfer approach. We prepared a triblock terpolymer that adopts a core-shell cylindrical morphology where the shell is an oxidizable polydimethylsiloxane block. Solvent annealed thin films of this terpolymer produce cylindrical features oriented perpendicular to the substrate surface. The polydimethylsiloxane shell is then converted into SiOx rings by an oxygen reactive ion etch. The resultant hard mask pattern is then transferred into Au, Ni80Fe20, and Ni80Cr20 thin films via Ar ion beam milling, demonstrating the generality of the approach.
各种材料的纳米环阵列在技术应用和基础研究方面都有很大的应用前景。在这项工作中，我们报告了使用嵌段聚合物光刻图形转移方法从金属薄膜中制备亚 50nm 直径环阵列的方法。我们制备了一种三嵌段共聚物，该共聚物采用核壳圆柱形态，其中壳是可氧化的聚二甲基硅氧烷嵌段。这种嵌段共聚物的溶剂退火薄膜产生垂直于基底表面取向的圆柱结构。然后，通过氧反应离子刻蚀将聚二甲基硅氧烷壳转化为 SiOx 环。通过氩离子束铣削将得到的硬掩模图案转移到 Au、Ni80Fe20 和 Ni80Cr20 薄膜中，证明了该方法的通用性。
