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基于二维电容式微机械超声换能器阵列的三维深度穿透光声成像

3-D Deep Penetration Photoacoustic Imaging with a 2-D CMUT Array.

作者信息

Ma Te-Jen, Kothapalli Sri Rajasekhar, Vaithilingam Srikant, Oralkan Omer, Kamaya Aya, Wygant Ira O, Zhuang Xuefeng, Gambhir Sanjiv S, Jeffrey R Brooke, Khuri-Yakub Butrus T

机构信息

Edward L. Ginzton Laboratory, Stanford University, USA.

出版信息

Proc IEEE Ultrason Symp. 2010 Oct 11;2010:375-377. doi: 10.1109/ULTSYM.2010.5935647.

Abstract

In this work, we demonstrate 3-D photoacoustic imaging of optically absorbing targets embedded as deep as 5 cm inside a highly scattering background medium using a 2-D capacitive micromachined ultrasonic transducer (CMUT) array with a center frequency of 5.5 MHz. 3-D volumetric images and 2-D maximum intensity projection images are presented to show the objects imaged at different depths. Due to the close proximity of the CMUT to the integrated frontend circuits, the CMUT array imaging system has a low noise floor. This makes the CMUT a promising technology for deep tissue photoacoustic imaging.

摘要

在这项工作中,我们使用中心频率为5.5 MHz的二维电容式微机电超声换能器(CMUT)阵列,展示了在高度散射背景介质中深度达5 cm处嵌入的光吸收目标的三维光声成像。呈现了三维体积图像和二维最大强度投影图像,以显示在不同深度成像的物体。由于CMUT与集成前端电路距离很近,CMUT阵列成像系统具有较低的本底噪声。这使得CMUT成为用于深层组织光声成像的一项很有前景的技术。

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本文引用的文献

1
Three-dimensional photoacoustic imaging using a two-dimensional CMUT array.基于二维 CMUT 阵列的三维光声成像。
IEEE Trans Ultrason Ferroelectr Freq Control. 2009 Nov;56(11):2411-9. doi: 10.1109/TUFFc.2009.1329.
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Nat Nanotechnol. 2008 Sep;3(9):557-62. doi: 10.1038/nnano.2008.231. Epub 2008 Aug 17.
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Capacitive micromachined ultrasonic transducers: fabrication technology.电容式微机械超声换能器:制造技术
IEEE Trans Ultrason Ferroelectr Freq Control. 2005 Dec;52(12):2242-58. doi: 10.1109/tuffc.2005.1563267.
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Adaptive imaging using the generalized coherence factor.使用广义相干因子的自适应成像。
IEEE Trans Ultrason Ferroelectr Freq Control. 2003 Feb;50(2):128-41. doi: 10.1109/tuffc.2003.1182117.

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