McGill University, Department of Physics Montreal, QC, Canada.
Nanotechnology. 2013 Mar 22;24(11):115301. doi: 10.1088/0957-4484/24/11/115301. Epub 2013 Feb 28.
Focused ion beam (FIB) milling is a common fabrication technique to make nanostencil masks which has the unintended consequence of gallium ion implantation surrounding milled features in silicon nitride membranes. We observe major changes in film structure, chemical composition, and magnetic behaviour of permalloy nanostructures deposited by electron beam evaporation using silicon nitride stencil masks made by a FIB as compared to stencil masks made by regular lithography techniques. We characterize the stenciled structures and both types of masks using transmission electron microscopy, electron energy loss spectroscopy, energy dispersive x-ray spectroscopy, magnetic force microscopy and kelvin probe force microscopy. All these techniques demonstrate distinct differences at a length scale of a 1-100 nm for the structures made using stencil mask fabricated using a FIB. The origin of these differences seems to be related to the presence of implanted ions, a detailed understanding of the mechanism however remains to be developed.
聚焦离子束(FIB)铣削是一种常见的制造纳米模板掩模的技术,但它也会带来意想不到的后果,即在氮化硅膜中铣削特征的周围会植入镓离子。我们观察到,与使用常规光刻技术制造的氮化硅模板掩模相比,使用电子束蒸发沉积的坡莫合金纳米结构的膜结构、化学成分和磁性能发生了重大变化。我们使用透射电子显微镜、电子能量损失光谱学、能量色散 X 射线光谱学、磁力显微镜和 Kelvin 探针力显微镜对掩模进行了表征。所有这些技术都表明,使用 FIB 制造的模板掩模制造的结构在 1-100nm 的长度尺度上存在明显差异。这些差异的起源似乎与注入离子的存在有关,但对其机制的详细理解仍有待进一步研究。