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一种用于硅片发射率补偿辐射测温法的降低背景辐射率的方法。

A method of reducing background radiance for emissivity-compensated radiation thermometry of silicon wafers.

作者信息

Iuchi T, Toyoda Y, Seo T

机构信息

School of Engineering, Toyo University, 2100 Kujirai, Kawagoe 350-8585, Japan.

出版信息

Rev Sci Instrum. 2013 Feb;84(2):024904. doi: 10.1063/1.4791793.

DOI:10.1063/1.4791793
PMID:23464239
Abstract

We studied the spectral and directional emissivities of silicon wafers using an optical polarization technique. Based on simulation and experimental results, we developed two radiation thermometry methods for silicon wafers: one is based on the polarized emissivity-invariant condition and the other is based on the relationship between the ratio of the p- and s-polarized radiance and the polarized emissivity. These methods can be performed at temperatures above 600 °C and over a wide wavelength range (0.9-4.8 μm), irrespective of the dielectric film thickness and the substrate resistivity, which depends on the dopant concentration. The temperature measurements were estimated to have expanded uncertainties (k = 2) of less than 5 °C. With a view to practically applying these methods, we investigated a method to reduce the intense background radiance produced by high-intensity heating lamps. We found that the background radiance can be greatly reduced by using a radiometer that is sensitive to wavelengths of 4.5 or 4.8 μm and suitable geometrical arrangements of a quartz plate. This opens up the possibility of using the two proposed radiation thermometry methods in practical applications.

摘要

我们使用光学偏振技术研究了硅片的光谱发射率和定向发射率。基于模拟和实验结果,我们开发了两种用于硅片的辐射测温方法:一种基于偏振发射率不变条件,另一种基于p偏振和s偏振辐射率之比与偏振发射率之间的关系。这些方法可以在600℃以上的温度和较宽的波长范围(0.9 - 4.8μm)内进行,与取决于掺杂剂浓度的介电膜厚度和衬底电阻率无关。温度测量的扩展不确定度(k = 2)估计小于5℃。为了实际应用这些方法,我们研究了一种减少高强度加热灯产生的强烈背景辐射的方法。我们发现,通过使用对4.5或4.8μm波长敏感的辐射计以及石英板的合适几何布置,可以大大降低背景辐射。这为在实际应用中使用所提出的两种辐射测温方法开辟了可能性。

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