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High-power flip-chip mounted photodiode array.

作者信息

Cross Allen S, Zhou Qiugui, Beling Andreas, Fu Yang, Campbell Joe C

机构信息

Department of Electrical and Computer Engineering, University of Virginia, 351 McCormick Road, Charlottesville, VA 22904, USA.

出版信息

Opt Express. 2013 Apr 22;21(8):9967-73. doi: 10.1364/OE.21.009967.

DOI:10.1364/OE.21.009967
PMID:23609702
Abstract

Four-element modified uni-traveling-carrier (MUTC) photodiode arrays (PDA) flip-chip bonded onto transmission lines on AlN substrates are demonstrated. High RF output powers of 26.2 dBm and 21.0 dBm are achieved at 35 GHz and 48 GHz, respectively, using a PDA with 28-μm diameter photodiodes. A systematic comparison between a PDA with four 20 μm-diameter elements and a discrete detector with the same active area (40-μm diameter) is presented. The PDA achieved higher output power and thermal dissipation compared to its discrete counterpart.

摘要

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