School of Mechanical, Materials & Mechatronic Engineering, University of Wollongong, NSW 2500, Australia.
Sci Rep. 2013;3:2373. doi: 10.1038/srep02373.
This paper reports a new technique that combines the features of Accumulative Roll Bonding (ARB) and Asymmetric Rolling (AR). This technique has been developed to enable production of ultra-thin bimetallic foils. Initially, 1.5 mm thick AA1050 and AA6061 foils were roll-bonded using ARB at 200°C, with 50% reduction. The resulting 1.5 mm bimetallic foil was subsequently thinned to 0.04 mm through four AR passes at room temperature. The speed ratio between the upper and lower AR rolls was 1:1.3. The tensile strength of the bimetallic foil was seen to increase with reduction in thickness. The ductility of the foil was seen to reduce upon decreasing the foil thickness from 1.5 mm to 0.14 mm, but increase upon further reduction in thickness from 0.14 mm to 0.04 mm. The grain size was about 140 nm for the AA6061 layer and 235 nm for the AA1050 layer, after the third AR pass.
本文报道了一种将累积轧合法（ARB）和非对称轧制（AR）的特点相结合的新技术。该技术的开发旨在实现超薄双金属箔的生产。最初，使用 ARB 在 200°C 下将 1.5 毫米厚的 AA1050 和 AA6061 箔轧至 50%的减厚率。然后，通过在室温下进行四次 AR 轧制，将所得的 1.5 毫米双金属箔减薄至 0.04 毫米。上下 AR 轧辊的速度比为 1:1.3。随着厚度的减小，双金属箔的拉伸强度增加。当箔厚度从 1.5 毫米减小到 0.14 毫米时，箔的延展性降低，但当厚度从 0.14 毫米进一步减小到 0.04 毫米时，延展性增加。第三次 AR 轧制后，AA6061 层的晶粒尺寸约为 140nm，AA1050 层的晶粒尺寸约为 235nm。
