International Studies Centre, Kaunas University of Technology, Kaunas 44244, Lithuania.
Sensors (Basel). 2013 Aug 22;13(9):11229-42. doi: 10.3390/s130911229.
The thermal imprint process of polymer micro-patterning is widely applied in areas such as manufacturing of optical parts, solar energy, bio-mechanical devices and chemical chips. Polycarbonate (PC), as an amorphous polymer, is often used in thermoforming processes because of its good replication characteristics. In order to obtain replicas of the best quality, the imprint parameters (e.g., pressure, temperature, time, etc.) must be determined. Therefore finite element model of the hot imprint process of lamellar periodical microstructure into PC has been created using COMSOL Multiphysics. The mathematical model of the hot imprint process includes three steps: heating, imprinting and demolding. The material properties of amorphous PC strongly depend on the imprint temperature and loading pressure. Polycarbonate was modelled as an elasto-plastic material, since it was analyzed below the glass transition temperature. The hot imprint model was solved using the heat transfer and the solid stress-strain application modes with thermal contact problem between the mold and polycarbonate. It was used for the evaluation of temperature and stress distributions in the polycarbonate during the hot imprint process. The quality of the replica, by means of lands filling ratio, was determined as well.
聚合物微图案的热压印工艺广泛应用于制造光学零件、太阳能、生物机械装置和化学芯片等领域。聚碳酸酯（PC）作为一种无定形聚合物，由于其良好的复制特性，常用于热成型工艺。为了获得最佳质量的复制品，必须确定压印参数（例如压力、温度、时间等）。因此，使用 COMSOL Multiphysics 为层状周期微结构的 PC 热压印工艺创建了有限元模型。热压印工艺的数学模型包括三个步骤：加热、压印和脱模。无定形 PC 的材料性能强烈依赖于压印温度和加载压力。聚碳酸酯被建模为弹塑性材料，因为它在玻璃化转变温度以下进行分析。使用热传递和固体应力-应变应用模式以及模具和聚碳酸酯之间的热接触问题来解决热压印模型。该模型用于评估聚碳酸酯在热压印过程中的温度和应力分布。通过填充率来确定复制品的质量。
