Department of Conservative Dentistry, Dental Science Research Institute, School of Dentistry, Chonnam National University, Gwangju, Korea.
J Appl Oral Sci. 2013 Jul-Aug;21(4):293-9. doi: 10.1590/1678-775720130036.
The purpose of this study was to investigate the polymerization temperature of a bulk filled composite resin light-activated with various light curing modes using infrared thermography according to the curing depth and approximation to the cavity wall.
Composite resin (AeliteFlo, Bisco, Schaumburg, IL, USA) was inserted into a Class II cavity prepared in the Teflon blocks and was cured with a LED light curing unit (Dr's Light, GoodDoctors Co., Seoul, Korea) using various light curing modes for 20 s. Polymerization temperature was measured with an infrared thermographic camera (Thermovision 900 SW/TE, Agema Infra-red Systems AB, Danderyd, Sweden) for 40 s at measurement spots adjacent to the cavity wall and in the middle of the cavity from the surface to a 4 mm depth. Data were analyzed according to the light curing modes with one-way ANOVA, and according to curing depth and approximation to the cavity wall with two-way ANOVA.
The peak polymerization temperature of the composite resin was not affected by the light curing modes. According to the curing depth, the peak polymerization temperature at the depth of 1 mm to 3 mm was significantly higher than that at the depth of 4 mm, and on the surface. The peak polymerization temperature of the spots in the middle of the cavity was higher than that measured in spots adjacent to the cavity wall.
In the photopolymerization of the composite resin, the temperature was higher in the middle of the cavity compared to the outer surface or at the internal walls of the prepared cavity.
本研究旨在通过红外热成像技术,根据固化深度和接近腔壁的程度,研究一种块状充填型复合树脂在不同光固化模式下的聚合温度。
将复合树脂(AeliteFlo,Bisco,Schaumburg,IL,美国)插入聚四氟乙烯块制备的 II 类腔中,并使用 LED 光固化器(Dr's Light,GoodDoctors Co.,首尔,韩国)以不同的光固化模式固化 20 秒。使用红外热成像相机(Thermovision 900 SW/TE,Agema Infra-red Systems AB,Danderyd,瑞典)在靠近腔壁和腔中间的测量点测量聚合温度,从表面到 4 毫米深度测量 40 秒。数据根据光固化模式进行单向方差分析,根据固化深度和接近腔壁进行双向方差分析。
复合树脂的峰值聚合温度不受光固化模式的影响。根据固化深度,1 毫米至 3 毫米深度的峰值聚合温度明显高于 4 毫米深度和表面的峰值聚合温度。腔中间位置的峰值聚合温度高于靠近腔壁位置的峰值聚合温度。
在复合树脂的光聚合过程中,腔中间的温度比外表面或制备腔的内壁高。