Trost Marcus, Herffurth Tobias, Schmitz David, Schröder Sven, Duparré Angela, Tünnermann Andreas
Appl Opt. 2013 Sep 10;52(26):6579-88. doi: 10.1364/AO.52.006579.
Subsurface damage (SSD) in optical components is almost unavoidably caused by mechanical forces involved during grinding and polishing and can be a limiting factor, in particular for applications that require high laser powers or an extreme material strength. In this paper, we report on the characterization of SSD in ground and polished optical surfaces, using different light scattering measurement techniques in the visible and extreme ultraviolet spectral ranges. The materials investigated include fused silica, borosilicate glass, and calcium fluoride. The scattering results are directly linked to classical destructive SSD characterization techniques, based on white light interferometry, optical microscopy, and atomic force microscopy of the substrate topography and cross sections obtained after etching in hydrofluoric acid and fracturing.
光学元件中的亚表面损伤(SSD)几乎不可避免地是由研磨和抛光过程中涉及的机械力引起的,并且可能成为一个限制因素,特别是对于需要高激光功率或极端材料强度的应用。在本文中,我们报告了在可见光谱和极紫外光谱范围内使用不同的光散射测量技术对研磨和抛光光学表面中的SSD进行的表征。所研究的材料包括熔融石英、硼硅酸盐玻璃和氟化钙。散射结果与基于白光干涉测量、光学显微镜以及对在氢氟酸中蚀刻和断裂后获得的衬底形貌和横截面进行原子力显微镜观察的经典破坏性SSD表征技术直接相关。