CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France.
Ultramicroscopy. 2014 Jan;136:185-92. doi: 10.1016/j.ultramic.2013.10.001. Epub 2013 Oct 17.
The structural and chemical properties of advanced nano-devices with a three-dimensional (3D) architecture have been studied at the nanometre scale. An original method has been used to characterize gate-all-around and tri-gate silicon nanowire transistor by combining electron tomography and atom probe tomography (APT). Results show that electron tomography is a well suited method to determine the morphological structure and the dimension variations of devices provided that the atomic number contrast is sufficient but without an absolute chemical identification. APT can map the 3D chemical distribution of the atoms in devices but suffers from strong distortions in the dimensions of the reconstructed volume. These may be corrected using a simple method based on atomic density correction and electron tomography data. Moreover, this combination is particularly useful in helping to understand the evaporation mechanisms and improve APT reconstructions. This paper demonstrated that a full 3D characterization of nano-devices requires the combination of both tomography techniques.
对具有三维(3D)结构的先进纳米器件的结构和化学性质进行了纳米尺度的研究。使用一种原始方法通过结合电子断层扫描和原子探针断层扫描(APT)对全栅极环绕和三栅硅纳米线晶体管进行了表征。结果表明,电子断层扫描是一种非常适合确定器件形态结构和尺寸变化的方法,前提是原子数对比度足够,但没有绝对的化学识别。APT 可以绘制器件中原子的 3D 化学分布,但在重建体积的尺寸上存在强烈的变形。可以使用基于原子密度校正和电子断层扫描数据的简单方法对其进行校正。此外,这种组合在帮助理解蒸发机制和改进 APT 重建方面特别有用。本文表明,对纳米器件的完整 3D 表征需要结合两种断层扫描技术。