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使用金属碳纳米管作为电极的高性能半导体富集碳纳米管薄膜晶体管。

High performance semiconducting enriched carbon nanotube thin film transistors using metallic carbon nanotubes as electrodes.

作者信息

Sarker Biddut K, Kang Narae, Khondaker Saiful I

机构信息

Nanoscience Technology Center, Department of Physics, School of Electrical Engineering and Computer Science, University of Central Florida, 12424 Research Parkway, Suite 400, Orlando, Florida 32826, USA.

出版信息

Nanoscale. 2014 May 7;6(9):4896-902. doi: 10.1039/c3nr06470k.

Abstract

High-performance solution-processed short-channel carbon nanotube (CNT) thin film transistors (TFTs) are fabricated using densely aligned arrays of metallic CNTs (m-CNTs) for the source and drain electrodes, while aligned arrays of semiconducting enriched CNTs (s-CNTs) are used as the channel material. The electrical transport measurements at room temperature show that using the m-CNT as the contact for the s-CNT array devices with a 2 μm channel length performed superior to those where the control Pd was the contact. The m-CNT contact devices exhibited a maximum (average) on-conductance of 36.5 μS (19.2 μS), a transconductance of 2.6 μS (1.2 μS), a mobility of 51 cm(2) V(-1) s(-1) (25 cm(2) V(-1) s(-1)), and a current on-off ratio of 1.1 × 10(6) (2.5 × 10(5)). These values are almost an order of magnitude higher than that of control Pd contact devices with the same channel length and s-CNT linear density. The low temperature charge transport measurements suggest that these improved performances are due to the m-CNT contact s-CNT devices having a lower Schottky barrier compared to the Pd contact s-CNT devices. We attribute this lower Schottky barrier to the unique geometry of our devices. In addition to using semiconducting enriched CNTs, our results suggest that using the metallic CNT as an electrode can significantly enhance the performance of CNT TFTs.

摘要

采用高性能溶液处理的短沟道碳纳米管(CNT)薄膜晶体管(TFT),其源极和漏极使用金属碳纳米管(m-CNT)的密集排列阵列,而半导体富集碳纳米管(s-CNT)的排列阵列用作沟道材料。室温下的电输运测量表明,对于沟道长度为2μm的s-CNT阵列器件,使用m-CNT作为接触电极的性能优于使用对照钯作为接触电极的器件。m-CNT接触器件表现出最大(平均)导通电导为36.5μS(19.2μS)、跨导为2.6μS(1.2μS)、迁移率为51cm²V⁻¹s⁻¹(25cm²V⁻¹s⁻¹)以及电流开/关比为1.1×10⁶(2.5×10⁵)。这些值比具有相同沟道长度和s-CNT线密度的对照钯接触器件几乎高一个数量级。低温电荷输运测量表明,这些性能的改善归因于m-CNT接触的s-CNT器件与钯接触的s-CNT器件相比具有更低的肖特基势垒。我们将这种更低的肖特基势垒归因于我们器件的独特几何结构。除了使用半导体富集碳纳米管外,我们的结果表明,使用金属碳纳米管作为电极可以显著提高CNT TFT的性能。

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