1] Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education & International Center for Dielectric Research, Xi'an Jiaotong University, Xi'an 710049, China [2] School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive NW, Atlanta, GA 30332, United States.
1] School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive NW, Atlanta, GA 30332, United States [2] Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences, Suzhou 215123, China.
Sci Rep. 2014 Apr 24;4:4779. doi: 10.1038/srep04779.
Polymer modified fillers in composites has attracted the attention of numerous researchers. These fillers are composed of core-shell structures that exhibit enhanced physical and chemical properties that are associated with shell surface control and encapsulated core materials. In this study, we have described an apt method to prepare polyimide (PI)-modified aluminum nitride (AlN) fillers, AlN@PI. These fillers are used for electronic encapsulation in high performance polymer composites. Compared with that of untreated AlN composite, these AlN@PI/epoxy composites exhibit better thermal and dielectric properties. At 40 wt% of filler loading, the highest thermal conductivity of AlN@PI/epoxy composite reached 2.03 W/mK. In this way, the thermal conductivity is approximately enhanced by 10.6 times than that of the used epoxy matrix. The experimental results exhibiting the thermal conductivity of AlN@PI/epoxy composites were in good agreement with the values calculated from the parallel conduction model. This research work describes an effective pathway that modifies the surface of fillers with polymer coating. Furthermore, this novel technique improves the thermal and dielectric properties of fillers and these can be used extensively for electronic packaging applications.
聚合物改性复合材料中的填料引起了众多研究人员的关注。这些填料由核壳结构组成，表现出增强的物理和化学性质，这与壳表面控制和封装的核心材料有关。在这项研究中，我们描述了一种合适的方法来制备聚酰亚胺（PI）改性氮化铝（AlN）填料，AlN@PI。这些填料用于高性能聚合物复合材料中的电子封装。与未处理的 AlN 复合材料相比，这些 AlN@PI/环氧树脂复合材料表现出更好的热学和介电性能。在 40wt%的填料负载下，AlN@PI/环氧树脂复合材料的热导率最高达到 2.03W/mK。通过这种方式，热导率大约比所使用的环氧树脂基体提高了 10.6 倍。实验结果显示 AlN@PI/环氧树脂复合材料的热导率与平行传导模型计算的值吻合较好。这项研究工作描述了一种用聚合物涂层修饰填料表面的有效途径。此外，这项新技术提高了填料的热学和介电性能，可广泛应用于电子封装应用。
