具有 AlN/BN 混合填料的高导热环氧树脂复合材料作为电子封装的底部填充封装材料

Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging.

作者信息

Lee Sanchez William Anderson, Li Jia-Wun, Chiu Hsien-Tang, Cheng Chih-Chia, Chiou Kuo-Chan, Lee Tzong-Ming, Chiu Chih-Wei

机构信息

Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan.

Graduate Institute of Applied Science and Technology, National Taiwan University of Science and Technology, Taipei 10607, Taiwan.

出版信息

Polymers (Basel). 2022 Jul 21;14(14):2950. doi: 10.3390/polym14142950.

In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN-BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN-BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.