用于集成电路温度测绘的有机-无机 Eu(3+)/Tb(3+)共掺杂杂化薄膜。

Organic-Inorganic Eu(3+)/Tb(3+) codoped hybrid films for temperature mapping in integrated circuits.

机构信息

Departamento de Física and CICECO, Universidade de Aveiro Aveiro, Portugal.

Departamento de Fisica de la Materia Condensada, Facultad de Ciencias and Instituto de Ciencia de Materiales de Aragón, CSIC-Universidad de Zaragoza Zaragoza, Spain.

出版信息

Front Chem. 2013 Jul 8;1:9. doi: 10.3389/fchem.2013.00009. eCollection 2013.

DOI:10.3389/fchem.2013.00009

PMID:24790938

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC3982520/

Abstract

The continuous decrease on the geometric size of electronic devices and integrated circuits generates higher local power densities and localized heating problems that cannot be characterized by conventional thermographic techniques. Here, a self-referencing intensity-based molecular thermometer involving a di-ureasil organic-inorganic hybrid thin film co-doped with Eu(3+) and Tb(3+) tris (β-diketonate) chelates is used to obtain the temperature map of a FR4 printed wiring board with spatio-temporal resolutions of 0.42 μm/4.8 ms.

摘要

电子设备和集成电路的几何尺寸不断减小，产生了更高的局部功率密度和局部加热问题，这不能用传统的热成像技术来描述。在这里，使用一种基于自参考强度的分子温度计，该温度计涉及共掺杂 Eu(3+)和 Tb(3+)三（β-二酮）配合物的二脲基有机-无机杂化薄膜，以获得具有 0.42 μm/4.8 ms 的时空分辨率的 FR4 印刷线路板的温度图。