Rajala Satu, Lekkala Jukka
Department of Automation Science and Engineering, Tampere University of Technology, Korkeakoulunkatu 3, FI-33101 Tampere, Finland.
Department of Automation Science and Engineering, Tampere University of Technology, Korkeakoulunkatu 3, FI-33101 Tampere, Finland.
Clin Biomech (Bristol). 2014 May;29(5):475-83. doi: 10.1016/j.clinbiomech.2014.04.009. Epub 2014 Apr 26.
Mechanical stress at the plantar surface has two components, pressure acting normal to the surface and shear stress acting tangential to the surface. Typically only pressure is measured and reported. However, plantar shear stress also plays a major role, especially in diabetic ulceration.
During the last few decades, a variety of methods have been developed for the measurement of plantar shear stress. This paper reviews the technologies used in plantar shear stress measurements.
Several technologies have been used, e.g. magneto-resistors, strain gauges, optical methods, piezoelectric materials and capacitive sensors. Examples of plantar shear stress values measured with the developed devices are also collected here and the relationship between sensor characteristics and the measured plantar shear stress distribution is discussed.
Even with the limitations of current plantar shear stress measurement technologies, they can provide useful information on the plantar stress distribution.
足底表面的机械应力有两个组成部分，垂直于表面作用的压力和切向于表面作用的剪切应力。通常仅测量和报告压力。然而，足底剪切应力也起着重要作用，尤其是在糖尿病溃疡方面。
在过去几十年中，已经开发出多种用于测量足底剪切应力的方法。本文综述了用于足底剪切应力测量的技术。
已经使用了多种技术，例如磁阻器、应变仪、光学方法、压电材料和电容式传感器。这里还收集了用已开发设备测量的足底剪切应力值的示例，并讨论了传感器特性与所测量的足底剪切应力分布之间的关系。
即使当前足底剪切应力测量技术存在局限性，但它们仍可为足底应力分布提供有用信息。
