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脉冲电化学刻蚀法制备均匀的 4H-SiC 介孔

Fabrication of uniform 4H-SiC mesopores by pulsed electrochemical etching.

机构信息

Department of Physics, Shanghai Normal University, 100 Guilin Road, Shanghai 200234, China.

出版信息

Nanoscale Res Lett. 2014 Oct 13;9(1):570. doi: 10.1186/1556-276X-9-570. eCollection 2014.

DOI:10.1186/1556-276X-9-570
PMID:25324708
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC4198072/
Abstract

In this letter, the uniform 4H silicon carbide (SiC) mesopores was fabricated by pulsed electrochemical etching method. The length of the mesopores is about 19 μm with a diameter of about 19 nm. The introduction of pause time (T off) is crucial to form the uniform 4H-SiC mesopores. The pore diameter will not change if etching goes with T off. The hole concentration decreasing at the pore tips during the T off is the main reason for uniformity.

摘要

在这封信中,通过脉冲电化学蚀刻法制备了均匀的 4H 碳化硅(SiC)介孔。介孔的长度约为 19μm,直径约为 19nm。引入暂停时间(Toff)对于形成均匀的 4H-SiC 介孔至关重要。如果蚀刻过程中伴随着 Toff,则孔径不会发生变化。在 Toff 期间孔尖端处的空穴浓度降低是均匀性的主要原因。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6f98/4198072/58779355016c/1556-276X-9-570-3.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6f98/4198072/c2dd1bd21a15/1556-276X-9-570-1.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6f98/4198072/4da9ddffe52c/1556-276X-9-570-2.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6f98/4198072/58779355016c/1556-276X-9-570-3.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6f98/4198072/c2dd1bd21a15/1556-276X-9-570-1.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6f98/4198072/4da9ddffe52c/1556-276X-9-570-2.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6f98/4198072/58779355016c/1556-276X-9-570-3.jpg

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本文引用的文献

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Room light anodic etching of highly doped n-type 4 H-SiC in high-concentration HF electrolytes: Difference between C and Si crystalline faces.在高浓度 HF 电解液中对高掺杂 n 型 4H-SiC 进行的室强光阳极电化学各向异性刻蚀:C 和 Si 晶面的差异。
Nanoscale Res Lett. 2012 Jul 3;7(1):367. doi: 10.1186/1556-276X-7-367.