Abdurrochman Andri, Lecler Sylvain, Mermet Frédéric, Tumbelaka Bernard Y, Serio Bruno, Fontaine Joël
Appl Opt. 2014 Nov 1;53(31):7202-7. doi: 10.1364/AO.53.007202.
Nanosecond near-IR lasers are commonly used for industrial laser processing. In this paper, we demonstrate that a 70 μm diameter beam generated from a 5 W, 28 ns, near-IR (1064 nm) Nd:YAG laser can etch a silicon wafer with a lateral feature size as small as 1.3 μm. Surprisingly with this laser, microetching can also be achieved on glass, despite the low absorption of this material at this wavelength. This breakthrough is carried out in ambient air by using glass microspheres with diameters between 4 and 40 μm that generate a concentrated beam at their vicinity, a phenomenon referred to as a photonic jet. The roles of parameters such as laser fluence, pulse number, microsphere diameter, and distance between the microsphere and the sample are discussed. A good correlation has been observed between the computed photonic jet intensity distribution and the etched marks' geometry.
纳秒近红外激光常用于工业激光加工。在本文中，我们证明了由一台5W、28ns、近红外（1064nm）的Nd:YAG激光器产生的直径为70μm的光束能够蚀刻出横向特征尺寸小至1.3μm的硅片。令人惊讶的是，使用这种激光器，尽管玻璃在该波长下吸收率较低，但也能在玻璃上实现微蚀刻。这一突破是在环境空气中通过使用直径在4至40μm之间的玻璃微球来实现的，这些玻璃微球在其附近产生聚焦光束，这种现象被称为光子喷射。讨论了激光能量密度、脉冲数、微球直径以及微球与样品之间的距离等参数的作用。在计算出的光子喷射强度分布与蚀刻痕迹的几何形状之间观察到了良好的相关性。
