Miyamoto Isamu, Okamoto Yasuhiro, Hansen Assi, Vihinen Joma, Amberla Tiina, Kangastupa Jarno
Opt Express. 2015 Feb 9;23(3):3427-39. doi: 10.1364/OE.23.003427.
A novel microwelding procedure to join Si-to-glass using ps-laser pulses with high repetition rates is presented. The procedure provides weld joint with mechanical strength as high as 85 MPa and 45 MPa in sample pairs of Si/aluminosilicate (Si/SW-Y) and Si/borosilicate (Si/Borofloat 33), respectively, which are higher than anodic bonding, at high spatial resolution (< 20 µm) and very high throughput without pre- and post-heating. Laser-matter interaction analysis indicates that excellent weld joint of Si/glass is obtained by avoiding violent evaporation of Si substrate using ps-laser pulses. Laser welded Si/glass samples can be singulated along the weld lines by standard blade dicer without defects, demonstrating welding by ps-laser pulses is applicable to wafer-level packaging.
本文介绍了一种使用具有高重复率的皮秒激光脉冲将硅与玻璃连接的新型微焊接工艺。该工艺在硅/铝硅酸盐（Si/SW-Y）和硅/硼硅酸盐（Si/Borofloat 33）样品对中分别提供高达85 MPa和45 MPa的机械强度的焊接接头，高于阳极键合，具有高空间分辨率（<20 µm）且无需预热和后加热即可实现非常高的通量。激光与物质相互作用分析表明，通过使用皮秒激光脉冲避免硅基板的剧烈蒸发，可获得优异的硅/玻璃焊接接头。激光焊接的硅/玻璃样品可以通过标准刀片切割机沿焊接线切割成单个，无缺陷，表明皮秒激光脉冲焊接适用于晶圆级封装。
