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一种用于微电子器件封装的新型整体式压电驱动挠曲机构线夹。

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging.

作者信息

Liang Cunman, Wang Fujun, Tian Yanling, Zhao Xingyu, Zhang Hongjie, Cui Liangyu, Zhang Dawei, Ferreira Placid

机构信息

Tianjin Key Laboratory of Equipment Design and Manufacturing Technology,School of Mechanical Engineering, Tianjin University, Tianjin 300072, China.

Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana 61801, USA.

出版信息

Rev Sci Instrum. 2015 Apr;86(4):045106. doi: 10.1063/1.4918621.

DOI:10.1063/1.4918621
PMID:25933896
Abstract

A novel monolithic piezoelectric actuated wire clamp is presented in this paper to achieve fast, accurate, and robust microelectronic device packaging. The wire clamp has compact, flexure-based mechanical structure and light weight. To obtain large and robust jaw displacements and ensure parallel jaw grasping, a two-stage amplification composed of a homothetic bridge type mechanism and a parallelogram leverage mechanism was designed. Pseudo-rigid-body model and Lagrange approaches were employed to conduct the kinematic, static, and dynamic modeling of the wire clamp and optimization design was carried out. The displacement amplification ratio, maximum allowable stress, and natural frequency were calculated. Finite element analysis (FEA) was conducted to evaluate the characteristics of the wire clamp and wire electro discharge machining technique was utilized to fabricate the monolithic structure. Experimental tests were carried out to investigate the performance and the experimental results match well with the theoretical calculation and FEA. The amplification ratio of the clamp is 20.96 and the working mode frequency is 895 Hz. Step response test shows that the wire clamp has fast response and high accuracy and the motion resolution is 0.2 μm. High speed precision grasping operations of gold and copper wires were realized using the wire clamper.

摘要

本文提出了一种新型整体式压电驱动线夹,以实现快速、准确且可靠的微电子器件封装。该线夹具有紧凑的、基于挠曲的机械结构且重量轻。为了获得大的且可靠的夹爪位移并确保夹爪平行抓取,设计了一种由相似桥式机构和平行四边形杠杆机构组成的两级放大机构。采用伪刚体模型和拉格朗日方法对线夹进行运动学、静力学和动力学建模,并进行了优化设计。计算了位移放大比、最大许用应力和固有频率。进行了有限元分析(FEA)以评估线夹的特性,并利用线电极放电加工技术制造整体结构。进行了实验测试以研究其性能,实验结果与理论计算和有限元分析结果吻合良好。该夹具的放大比为20.96,工作模态频率为895Hz。阶跃响应测试表明,该线夹响应快速且精度高,运动分辨率为0.2μm。使用该线夹实现了金线和铜线的高速精密抓取操作。

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