Lavasani Hossein Miri, Abdolvand Reza, Ayazi Farrokh
IEEE Trans Ultrason Ferroelectr Freq Control. 2015 May;62(5):802-13. doi: 10.1109/TUFFC.2015.007051.
This paper reports on the design, implementation, and phase-noise optimization of low-power interface IC for dual-frequency oscillators that utilize two high quality factor (Q) width-extensional bulk acoustic modes of the same AlN-on-silicon resonator. Two 0.5-μm CMOS transimpedance amplifiers (TIA) have been designed, characterized, and interfaced with two dual-mode resonators operating at 35.5/105.7 MHz (first/third order modes) and 35.5/174.9 MHz (first/ fifth order modes). One TIA uses open-loop regulated cascode (RGC) topology in the first stage to enable low power operation, whereas the second one uses an inverter with shunt-shunt feedback to deliver higher gain with lower phase noise. An on-chip switching network is incorporated into each TIA to change the oscillation frequency based on the different phase shift. The effect of TIA on the phase-noise performance of oscillators is studied and compared for both topologies. The measured phase noise of low- and high-frequency modes at 1 kHz offset from carrier are -114 and -108 dBc/Hz for the 35/105 MHz oscillator, and -108 and -105 dBc/Hz for the 35/175 MHz oscillator, respectively, whereas the far-from-carrier reaches below -140 dBc/Hz in all cases.
本文报道了一种用于双频振荡器的低功耗接口集成电路的设计、实现及相位噪声优化,该振荡器利用了同一硅基氮化铝谐振器的两种高品质因数(Q)宽度扩展体声波模式。设计并表征了两个0.5μm CMOS跨阻放大器(TIA),并将其与两个分别工作在35.5/105.7 MHz(一阶/三阶模式)和35.5/174.9 MHz(一阶/五阶模式)的双模谐振器相连。一个TIA在第一级采用开环调节共源共栅(RGC)拓扑结构以实现低功耗运行,而另一个则采用带有并联-并联反馈的反相器以提供更高增益和更低相位噪声。每个TIA中都集成了一个片上开关网络,用于根据不同的相移改变振荡频率。研究并比较了两种拓扑结构下TIA对振荡器相位噪声性能的影响。对于35/105 MHz振荡器,在载波偏移1 kHz处,低频和高频模式的实测相位噪声分别为-114和-108 dBc/Hz;对于35/175 MHz振荡器,分别为-108和-105 dBc/Hz,而在所有情况下,远离载波处的相位噪声均低于-140 dBc/Hz。