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基于横向场激励压电 AlN 外形模式 MEMS 谐振器的 1.05-GHz CMOS 振荡器。

1.05-GHz CMOS oscillator based on lateral- field-excited piezoelectric AlN contour- mode MEMS resonators.

机构信息

Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA.

出版信息

IEEE Trans Ultrason Ferroelectr Freq Control. 2010 Jan;57(1):82-7. doi: 10.1109/TUFFC.1382.

Abstract

This paper reports on the first demonstration of a 1.05-GHz microelectromechanical (MEMS) oscillator based on lateral-field-excited (LFE) piezoelectric AlN contourmode resonators. The oscillator shows a phase noise level of -81 dBc/Hz at 1-kHz offset frequency and a phase noise floor of -146 dBc/Hz, which satisfies the global system for mobile communications (GSM) requirements for ultra-high frequency (UHF) local oscillators (LO). The circuit was fabricated in the AMI semiconductor (AMIS) 0.5-microm complementary metaloxide- semiconductor (CMOS) process, with the oscillator core consuming only 3.5 mW DC power. The device overall performance has the best figure-of-merit (FoM) when compared with other gigahertz oscillators that are based on film bulk acoustic resonator (FBAR), surface acoustic wave (SAW), and CMOS on-chip inductor and capacitor (CMOS LC) technologies. A simple 2-mask process was used to fabricate the LFE AlN resonators operating between 843 MHz and 1.64 GHz with simultaneously high Q (up to 2,200) and kt 2 (up to 1.2%). This process further relaxes manufacturing tolerances and improves yield. All these advantages make these devices suitable for post-CMOS integrated on-chip direct gigahertz frequency synthesis in reconfigurable multiband wireless communications.

摘要

本文报道了基于横向场激励(LFE)压电 AlN 外形模式谐振器的首个 1.05GHz 微机电系统(MEMS)振荡器的演示。该振荡器在 1kHz 偏移频率下表现出-81dBc/Hz 的相位噪声电平,相位噪声底为-146dBc/Hz,满足全球移动通信系统(GSM)对超高频(UHF)本地振荡器(LO)的要求。该电路采用 AMI 半导体(AMIS)0.5μm 互补金属氧化物半导体(CMOS)工艺制造,振荡器核心仅消耗 3.5mW 的直流功率。与基于薄膜体声波谐振器(FBAR)、表面声波(SAW)和 CMOS 片上电感和电容(CMOS LC)技术的其他千兆赫振荡器相比,该器件的整体性能具有最佳的品质因数(FoM)。采用简单的 2 掩模工艺制造 LFE AlN 谐振器,工作频率在 843MHz 至 1.64GHz 之间,同时具有高 Q(高达 2200)和 kt2(高达 1.2%)。该工艺进一步放宽了制造公差并提高了成品率。所有这些优势使得这些器件适用于 CMOS 后集成的片上直接千兆赫频率合成,用于可重构多频带无线通信。

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