Vidor Michele Machado, Felix Rafael Perdomo, Marchioro Ernani Menezes, Hahn Luciane
Universidade Federal do Rio Grande do Sul, Santa Cecília, Rio Grande do Sul, Brazil.
Pontifícia Universidade Católica do Rio Grande do Sul, Porto Alegre, Rio Grande do Sul, Brazil.
Dental Press J Orthod. 2015 Mar-Apr;20(2):61-7. doi: 10.1590/2176-9451.20.2.061-067.oar.
To assess enamel surface under scanning electron microscopy (SEM) after resin removal and enamel polishing procedures following brackets debonding, as well as compare the time required for these procedures.
A total of 180 deciduous bovine incisors were used. The enamel surface of each tooth was prepared and brackets were bonded with light cured Transbond XT composite resin. Brackets were removed in a testing machine. The samples were randomized and equally distributed into nine groups according to the resin removal and polishing technique: Group 1, 30-blade tungsten carbide bur in high speed; Group 2, 30-blade tungsten carbide bur in high speed followed by a sequence of 4 Sof-lex polishing discs (3M); Group 3, 30-blade tungsten carbide bur in high speed followed by Enhance tips (Dentsply). All groups were subdivided into (a) unpolished; (b) polished with aluminum oxide paste; and (c) polished with water slurry of fine pumice. Subsequently, the enamel surface was assessed and statistical analysis was carried out.
There were statistically significant differences in enamel roughness and removal time among all groups. Groups 3a, 3b and 3c appeared to be the most efficient methods of removing resin with low damages to enamel. Groups 2a, 2b and 2c were the most time consuming procedures, and Group 2a caused more damages to enamel.
The suggested protocol for resin removal is the 30-blade tungsten carbide bur in high speed followed by Enhance tips and polishing with aluminum oxide paste. This procedure seems to produce less damages and is less time consuming.
在托槽拆除后,通过扫描电子显微镜(SEM)评估树脂去除和牙釉质抛光程序后的牙釉质表面,并比较这些程序所需的时间。
总共使用了180颗乳牙牛切牙。制备每颗牙齿的牙釉质表面,并用光固化Transbond XT复合树脂粘结托槽。在测试机上拆除托槽。根据树脂去除和抛光技术,将样本随机分为九组:第1组,高速使用30刃碳化钨车针;第2组,高速使用30刃碳化钨车针,然后依次使用4片Sof-lex抛光盘(3M公司);第3组,高速使用30刃碳化钨车针,然后使用Enhance磨头(登士柏公司)。所有组再细分为(a)未抛光;(b)用氧化铝糊剂抛光;(c)用细浮石水浆抛光。随后,对牙釉质表面进行评估并进行统计分析。
所有组在牙釉质粗糙度和去除时间上存在统计学显著差异。第3组的a、b和c似乎是去除树脂且对牙釉质损伤较小的最有效方法。第2组的a、b和c是最耗时的程序,且第2组的a对牙釉质造成的损伤更大。
建议的树脂去除方案是高速使用30刃碳化钨车针,然后使用Enhance磨头,并用氧化铝糊剂抛光。该程序似乎造成的损伤较小且耗时较少。