Xia Jin, Yang Chunguang, Xu Dake, Sun Da, Nan Li, Sun Ziqing, Li Qi, Gu Tingyue, Yang Ke
a College of Chemistry , Liaoning University , Shenyang , China.
Biofouling. 2015;31(6):481-92. doi: 10.1080/08927014.2015.1062089.
The microbiologically influenced corrosion (MIC) resistance of a novel Cu-bearing 2205 duplex stainless steel (2205 Cu-DSS) against an aerobic marine Pseudomonas aeruginosa biofilm was investigated. The electrochemical test results showed that Rp increased and icorr decreased sharply after long-term immersion in the inoculation medium, suggesting that 2205 Cu-DSS possessed excellent MIC resistance to the P. aeruginosa biofilm. Fluorescence microscope images showed that 2205 Cu-DSS possessed a strong antibacterial ability, and its antibacterial efficiency after one and seven days was 7.75% and 96.92%, respectively. The pit morphology comparison after 14 days between 2205 DSS and 2205 Cu-DSS demonstrated that the latter showed a considerably reduced maximum MIC pit depth compared with the former (1.44 μm vs 9.50 μm). The experimental results suggest that inhibition of the biofilm was caused by the copper ions released from the 2205 Cu-DSS, leading to its effective mitigation of MIC by P. aeruginosa.
研究了一种新型含铜2205双相不锈钢(2205 Cu-DSS)对需氧海洋铜绿假单胞菌生物膜的微生物影响腐蚀(MIC)抗性。电化学测试结果表明,在接种培养基中长期浸泡后,极化电阻(Rp)增加,腐蚀电流密度(icorr)急剧下降,这表明2205 Cu-DSS对铜绿假单胞菌生物膜具有优异的抗MIC性能。荧光显微镜图像显示,2205 Cu-DSS具有很强的抗菌能力,其在第1天和第7天的抗菌效率分别为7.75%和96.92%。2205双相不锈钢(2205 DSS)和2205 Cu-DSS在14天后的点蚀形貌比较表明,与前者相比,后者的最大MIC点蚀深度显著降低(1.44μm对9.50μm)。实验结果表明,生物膜的抑制是由2205 Cu-DSS释放的铜离子引起的,从而有效减轻了铜绿假单胞菌引起的MIC。