Zhao Chumin, Kanicki Jerzy, Konstantinidis Anastasios C, Patel Tushita
Solid-State Electronics Laboratory, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan 48109.
Department of Medical Physics and Biomedical Engineering, University College London, London WC1E 6BT, United Kingdom and Diagnostic Radiology and Radiation Protection, Christie Medical Physics and Engineering, The Christie NHS Foundation Trust, Manchester M20 4BX, United Kingdom.
Med Phys. 2015 Nov;42(11):6294-308. doi: 10.1118/1.4932368.
Large area x-ray imagers based on complementary metal-oxide-semiconductor (CMOS) active pixel sensor (APS) technology have been proposed for various medical imaging applications including digital breast tomosynthesis (DBT). The low electronic noise (50-300 e-) of CMOS APS x-ray imagers provides a possible route to shrink the pixel pitch to smaller than 75 μm for microcalcification detection and possible reduction of the DBT mean glandular dose (MGD).
In this study, imaging performance of a large area (29×23 cm2) CMOS APS x-ray imager [Dexela 2923 MAM (PerkinElmer, London)] with a pixel pitch of 75 μm was characterized and modeled. The authors developed a cascaded system model for CMOS APS x-ray imagers using both a broadband x-ray radiation and monochromatic synchrotron radiation. The experimental data including modulation transfer function, noise power spectrum, and detective quantum efficiency (DQE) were theoretically described using the proposed cascaded system model with satisfactory consistency to experimental results. Both high full well and low full well (LFW) modes of the Dexela 2923 MAM CMOS APS x-ray imager were characterized and modeled. The cascaded system analysis results were further used to extract the contrast-to-noise ratio (CNR) for microcalcifications with sizes of 165-400 μm at various MGDs. The impact of electronic noise on CNR was also evaluated.
The LFW mode shows better DQE at low air kerma (Ka<10 μGy) and should be used for DBT. At current DBT applications, air kerma (Ka∼10 μGy, broadband radiation of 28 kVp), DQE of more than 0.7 and ∼0.3 was achieved using the LFW mode at spatial frequency of 0.5 line pairs per millimeter (lp/mm) and Nyquist frequency ∼6.7 lp/mm, respectively. It is shown that microcalcifications of 165-400 μm in size can be resolved using a MGD range of 0.3-1 mGy, respectively. In comparison to a General Electric GEN2 prototype DBT system (at MGD of 2.5 mGy), an increased CNR (by ∼10) for microcalcifications was observed using the Dexela 2923 MAM CMOS APS x-ray imager at a lower MGD (2.0 mGy).
The Dexela 2923 MAM CMOS APS x-ray imager is capable to achieve a high imaging performance at spatial frequencies up to 6.7 lp/mm. Microcalcifications of 165 μm are distinguishable based on reported data and their modeling results due to the small pixel pitch of 75 μm. At the same time, potential dose reduction is expected using the studied CMOS APS x-ray imager.
基于互补金属氧化物半导体(CMOS)有源像素传感器(APS)技术的大面积X射线成像器已被应用于包括数字乳腺断层合成(DBT)在内的各种医学成像应用中。CMOS APS X射线成像器的低电子噪声(50 - 300 e-)为将像素间距缩小至小于75μm以进行微钙化检测以及可能降低DBT平均腺体剂量(MGD)提供了一条可行途径。
在本研究中,对一款像素间距为75μm的大面积(29×23 cm²)CMOS APS X射线成像器[Dexela 2923 MAM(珀金埃尔默公司,伦敦)]的成像性能进行了表征和建模。作者开发了一种用于CMOS APS X射线成像器的级联系统模型,该模型同时使用宽带X射线辐射和单色同步辐射。利用所提出的级联系统模型从理论上描述了包括调制传递函数、噪声功率谱和探测量子效率(DQE)在内的实验数据,与实验结果具有令人满意的一致性。对Dexela 2923 MAM CMOS APS X射线成像器的高满阱和低满阱(LFW)模式均进行了表征和建模。级联系统分析结果进一步用于提取在不同MGD下尺寸为165 - 400μm的微钙化的对比度噪声比(CNR)。还评估了电子噪声对CNR的影响。
LFW模式在低空气比释动能(Ka<10μGy)时显示出更好的DQE,应将其用于DBT。在当前的DBT应用中,对于空气比释动能(Ka∼10μGy,28 kVp宽带辐射),使用LFW模式在空间频率为0.5线对每毫米(lp/mm)和奈奎斯特频率约6.7 lp/mm时,分别实现了超过0.7和约0.3的DQE。结果表明,尺寸为165 - 400μm的微钙化分别在0.3 - 1 mGy的MGD范围内可以分辨出来。与通用电气GEN2原型DBT系统(MGD为2.5 mGy)相比,使用Dexela 2923 MAM CMOS APS X射线成像器在较低MGD(2.0 mGy)时观察到微钙化的CNR有所提高(约提高10倍)。
Dexela 2923 MAM CMOS APS X射线成像器能够在高达6.7 lp/mm的空间频率下实现高成像性能。由于75μm的小像素间距,根据报告数据及其建模结果,165μm的微钙化是可区分的。同时,预计使用所研究的CMOS APS X射线成像器可实现潜在的剂量降低。