Zhang Guodong, Cheng Guanghua
Appl Opt. 2015 Oct 20;54(30):8957-61. doi: 10.1364/AO.54.008957.
In the welding process between similar or dissimilar materials, inserting an intermediate layer and pressure assistance are usually thought to be necessary. In this paper, the direct welding between alumina-silicate glass and metal (aluminum, copper, and steel), under exposure from 1 kHz femtosecond laser pulses without any auxiliary processes, is demonstrated. The micron/nanometer-sized metal particles induced by laser ablation were considered to act as the adhesive in the welding process. The welding parameters were optimized by varying the pulse energy and the translation velocity of the sample. The shear joining strength characterized by a shear force testing equipment was as high as 2.34 MPa. This direct bonding technology has potential for applications in medical devices, sensors, and photovoltaic devices.
在同种或异种材料之间的焊接过程中,通常认为插入中间层和施加压力是必要的。本文展示了在无任何辅助工艺的情况下,在1kHz飞秒激光脉冲照射下,硅酸铝玻璃与金属(铝、铜和钢)之间的直接焊接。激光烧蚀诱导产生的微米/纳米级金属颗粒被认为在焊接过程中起到了粘合剂的作用。通过改变脉冲能量和样品的平移速度对焊接参数进行了优化。用剪切力测试设备表征的剪切连接强度高达2.34MPa。这种直接键合技术在医疗设备、传感器和光伏设备中具有应用潜力。