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银纳米浆料的激光诱导正向转移

Laser-induced Forward Transfer of Ag Nanopaste.

作者信息

Breckenfeld Eric, Kim Heungsoo, Auyeung Raymond C Y, Piqué Alberto

机构信息

National Research Council Research Associates Program, Naval Research Laboratory;

Materials Science and Technology Division, Naval Research Laboratory.

出版信息

J Vis Exp. 2016 Mar 31(109):e53728. doi: 10.3791/53728.

DOI:10.3791/53728
PMID:27077645
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC4841327/
Abstract

Over the past decade, there has been much development of non-lithographic methods(1-3) for printing metallic inks or other functional materials. Many of these processes such as inkjet(3) and laser-induced forward transfer (LIFT)(4) have become increasingly popular as interest in printable electronics and maskless patterning has grown. These additive manufacturing processes are inexpensive, environmentally friendly, and well suited for rapid prototyping, when compared to more traditional semiconductor processing techniques. While most direct-write processes are confined to two-dimensional structures and cannot handle materials with high viscosity (particularly inkjet), LIFT can transcend both constraints if performed properly. Congruent transfer of three dimensional pixels (called voxels), also referred to as laser decal transfer (LDT)(5-9), has recently been demonstrated with the LIFT technique using highly viscous Ag nanopastes to fabricate freestanding interconnects, complex voxel shapes, and high-aspect-ratio structures. In this paper, we demonstrate a simple yet versatile process for fabricating a variety of micro- and macroscale Ag structures. Structures include simple shapes for patterning electrical contacts, bridging and cantilever structures, high-aspect-ratio structures, and single-shot, large area transfers using a commercial digital micromirror device (DMD) chip.

摘要

在过去十年中,用于印刷金属油墨或其他功能材料的非光刻方法(1-3)有了很大发展。随着对可印刷电子产品和无掩膜图案化的兴趣增加,许多此类工艺,如喷墨印刷(3)和激光诱导正向转移(LIFT)(4)越来越受欢迎。与更传统的半导体加工技术相比,这些增材制造工艺成本低廉、环境友好,且非常适合快速原型制作。虽然大多数直接写入工艺仅限于二维结构,无法处理高粘度材料(特别是喷墨印刷),但如果操作得当,LIFT可以突破这两个限制。最近已经通过LIFT技术展示了三维像素(称为体素)的全等转移,也称为激光贴花转移(LDT)(5-9),该技术使用高粘度的银纳米浆料来制造独立的互连结构、复杂的体素形状和高纵横比结构。在本文中,我们展示了一种简单而通用的工艺,用于制造各种微观和宏观尺度的银结构。这些结构包括用于图案化电触点的简单形状、桥接和悬臂结构、高纵横比结构,以及使用商用数字微镜器件(DMD)芯片进行的单次大面积转移。

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