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转移印花技术在材料组装和微纳器件制造中的应用。

Transfer printing techniques for materials assembly and micro/nanodevice fabrication.

机构信息

Department of Materials Science and Engineering, Fredrick Seitz Materials Research Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, USA.

出版信息

Adv Mater. 2012 Oct 9;24(39):5284-318. doi: 10.1002/adma.201201386. Epub 2012 Aug 31.

Abstract

Transfer printing represents a set of techniques for deterministic assembly of micro-and nanomaterials into spatially organized, functional arrangements with two and three-dimensional layouts. Such processes provide versatile routes not only to test structures and vehicles for scientific studies but also to high-performance, heterogeneously integrated functional systems, including those in flexible electronics, three-dimensional and/or curvilinear optoelectronics, and bio-integrated sensing and therapeutic devices. This article summarizes recent advances in a variety of transfer printing techniques, ranging from the mechanics and materials aspects that govern their operation to engineering features of their use in systems with varying levels of complexity. A concluding section presents perspectives on opportunities for basic and applied research, and on emerging use of these methods in high throughput, industrial-scale manufacturing.

摘要

转印技术代表了一组技术,用于将微纳材料以确定的方式组装成具有二维和三维布局的空间组织、功能排列。这些工艺不仅提供了测试结构和科学研究载体的通用途径,而且还提供了高性能、异质集成的功能系统,包括在柔性电子、三维和/或曲线形光电、生物集成传感和治疗装置中的系统。本文总结了各种转印技术的最新进展,涵盖了控制其操作的力学和材料方面,以及它们在不同复杂程度的系统中的使用的工程特点。最后一节提出了对基础和应用研究机会的看法,以及对这些方法在高通量、工业规模制造中的新兴应用的看法。

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