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原子层沉积法生长的 MoS2 薄膜的晶圆级规模。

Wafer-scale growth of MoS2 thin films by atomic layer deposition.

机构信息

Center for Electronic Materials, Korea Institute of Science and Technology, Seoul 02792, Korea.

出版信息

Nanoscale. 2016 May 19;8(20):10792-8. doi: 10.1039/c6nr01346e.

Abstract

The wafer-scale synthesis of MoS2 layers with precise thickness controllability and excellent uniformity is essential for their application in the nanoelectronics industry. Here, we demonstrate the atomic layer deposition (ALD) of MoS2 films with Mo(CO)6 and H2S as the Mo and S precursors, respectively. A self-limiting growth behavior is observed in the narrow ALD window of 155-175 °C. Long H2S feeding times are necessary to reduce the impurity contents in the films. The as-grown MoS2 films are amorphous due to the low growth temperature. Post-annealing at high temperatures under a H2S atmosphere efficiently improves the film properties including the crystallinity and chemical composition. An extremely uniform film growth is achieved even on a 4 inch SiO2/Si wafer. These results demonstrate that the current ALD process is well suited for the synthesis of MoS2 layers for application in industry.

摘要

晶圆级的 MoS2 层的精确厚度可控性和优异的均匀性合成对于它们在纳米电子学工业中的应用至关重要。在这里,我们展示了 Mo(CO)6 和 H2S 分别作为 Mo 和 S 前驱体的 MoS2 薄膜的原子层沉积 (ALD)。在 155-175°C 的狭窄 ALD 窗口中观察到自限制生长行为。需要长时间的 H2S 进料时间来降低薄膜中的杂质含量。由于生长温度低,所生长的 MoS2 薄膜为非晶态。在 H2S 气氛下高温退火可以有效地改善薄膜性能,包括结晶度和化学成分。即使在 4 英寸的 SiO2/Si 晶圆上也可以实现非常均匀的薄膜生长。这些结果表明,当前的 ALD 工艺非常适合用于合成 MoS2 层,以应用于工业领域。

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