Faradzhev Nadir S, Hill Shannon B
National Institute of Standards and Technology Gaithersburg, MD 20899, USA.
Surf Sci. 2016 Oct;652:200-205. doi: 10.1016/j.susc.2016.03.025. Epub 2016 Mar 26.
Previously we reported estimates of the maximum etch rates of C on TiO by oxidizers including NO, O and HO when irradiated by a spatially-non-uniform beam of extreme ultraviolet (EUV) radiation at 13.5 nm (Faradzhev et al., 2013). Here we extend that work by presenting temporally and spatially resolved measurements of the C etching by these oxidizers as a function of EUV intensity in the range (0.3 to 3) mW/mm [(0.2 to 2) × 10 photons s cm]. We find that the rates for NO scale linearly with intensity and are smaller than those for O, which exhibit a weak, sub-linear intensity dependence in this range. We demonstrate that these behaviors are consistent with adsorption of the oxidizing precursor on the C surface followed by a photon-stimulated reaction resulting in volatile C-containing products. The kinetics of photon-induced C etching by hydrogen peroxide, however, appear to be more complex. The spatially resolved measurements reveal that C removal by HO begins at the edges of the C spot, where the light intensity is the lowest, and proceeds toward the center of the spot. This localization of the reaction may occur because hydroxyl radicals are produced efficiently on the catalytically active TiO surface.
此前我们报道了在13.5纳米极紫外(EUV)辐射的空间非均匀光束照射下,包括NO、O和HO在内的氧化剂对TiO上C的最大蚀刻速率的估计值(Faradzhev等人,2013年)。在此,我们扩展了这项工作,给出了这些氧化剂对C的蚀刻在时间和空间上的分辨测量结果,该结果是EUV强度在(0.3至3)毫瓦/平方毫米[(0.2至2)×10光子每秒平方厘米]范围内的函数。我们发现,NO的蚀刻速率与强度呈线性关系,且小于O的蚀刻速率,在该范围内O表现出较弱的亚线性强度依赖性。我们证明,这些行为与氧化前驱体在C表面的吸附,随后是光子激发反应生成挥发性含C产物是一致的。然而,过氧化氢对光子诱导的C蚀刻动力学似乎更为复杂。空间分辨测量表明,HO对C的去除始于C光斑的边缘,那里光强度最低,然后向光斑中心推进。反应的这种局部化可能是因为在具有催化活性的TiO表面能高效产生羟基自由基。