Lu Huihui, Lee Jun Su, Zhao Yan, Scarcella Carmelo, Cardile Paolo, Daly Aidan, Ortsiefer Markus, Carroll Lee, O'Brien Peter
Opt Express. 2016 Jul 25;24(15):16258-66. doi: 10.1364/OE.24.016258.
In this article we describe a cost-effective approach for hybrid laser integration, in which vertical cavity surface emitting lasers (VCSELs) are passively-aligned and flip-chip bonded to a Si photonic integrated circuit (PIC), with a tilt-angle optimized for optical-insertion into standard grating-couplers. A tilt-angle of 10° is achieved by controlling the reflow of the solder ball deposition used for the electrical-contacting and mechanical-bonding of the VCSEL to the PIC. After flip-chip integration, the VCSEL-to-PIC insertion loss is -11.8 dB, indicating an excess coupling penalty of -5.9 dB, compared to Fibre-to-PIC coupling. Finite difference time domain simulations indicate that the penalty arises from the relatively poor match between the VCSEL mode and the grating-coupler.
在本文中，我们描述了一种用于混合激光集成的经济高效方法，其中垂直腔面发射激光器（VCSEL）被被动对准并倒装芯片键合到硅光子集成电路（PIC）上，其倾斜角针对光学插入标准光栅耦合器进行了优化。通过控制用于VCSEL与PIC的电接触和机械键合的焊球沉积的回流，可实现10°的倾斜角。倒装芯片集成后，VCSEL到PIC的插入损耗为-11.8 dB，与光纤到PIC的耦合相比，表明存在-5.9 dB的额外耦合损耗。时域有限差分模拟表明，该损耗源于VCSEL模式与光栅耦合器之间相对较差的匹配。
