Department of Materials Science and Engineering, Rutgers, The State University of New Jersey , Piscataway, New Jersey 08854, United States.
Department of Physics, University of Illinois at Urbana-Champaign , Urbana, Illinois 61801, United States.
Nano Lett. 2016 Sep 14;16(9):5528-32. doi: 10.1021/acs.nanolett.6b02044. Epub 2016 Aug 31.
In a topological insulator (TI), if its spin-orbit coupling (SOC) strength is gradually reduced, the TI eventually transforms into a trivial insulator beyond a critical point of SOC, at which point the bulk gap closes: this is the standard description of the topological phase transition (TPT). However, this description of TPT, driven solely by the SOC (or something equivalent) and followed by closing and reopening of the bulk band gap, is valid only for infinite-size samples, and little is known how TPT occurs for finite-size samples. Here, using both systematic transport measurements on interface-engineered (Bi1-xInx)2Se3 thin films and theoretical simulations (with animations in the Supporting Information), we show that description of TPT in finite-size samples needs to be substantially modified from the conventional picture of TPT due to surface-state hybridization and bulk confinement effects. We also show that the finite-size TPT is composed of two separate transitions, topological-normal transition (TNT) and metal-insulator transition (MIT), by providing a detailed phase diagram in the two-dimensional phase space of sample size and SOC strength.
在拓扑绝缘体 (TI) 中,如果其自旋轨道耦合 (SOC) 强度逐渐降低,那么在 SOC 的临界点之后,TI 将最终转变为平凡绝缘体,此时体带隙关闭:这是拓扑相变 (TPT) 的标准描述。然而,这种仅由 SOC(或等效物)驱动的 TPT 描述,以及随之而来的体带隙的关闭和重新打开,仅适用于无限大的样品,对于有限大的样品,TPT 如何发生知之甚少。在这里,我们使用界面工程化 (Bi1-xInx)2Se3 薄膜的系统输运测量和理论模拟(在支持信息中提供动画),表明由于表面态杂化和体限制效应,有限大样品中的 TPT 描述需要从 TPT 的传统描述进行实质性修改。我们还通过在样品尺寸和 SOC 强度的二维相空间中提供详细的相图,表明有限大 TPT 由两个独立的转变组成,拓扑-正常转变 (TNT) 和金属-绝缘体转变 (MIT)。