Liu Sha, Zhang Xue-Xian
Institute of Natural and Mathematical Sciences, Massey University, Auckland 0745, New Zealand.
J Med Microbiol. 2016 Oct;65(10):1143-1151. doi: 10.1099/jmm.0.000348. Epub 2016 Sep 2.
Applying self-sanitizing copper surfaces to commonly touched places within hospital facilities is an emerging strategy to prevent healthcare-associated infections. This is due to the fact that bacterial pathogens are rapidly killed on copper, a process termed contact killing. However, the mechanisms of contact killing are not fully understood, and the potential of bacterial pathogens to develop resistance has rarely been explored. Here, we hypothesize that bacteria are predominantly killed by a burst release of toxic copper ions, resulting from chemical reactions between bacterial cell surface components and metallic copper. To test this, we isolated and characterized small colony variants (SCVs) derived from Pseudomonas aeruginosa and Staphylococcus aureus. SCVs overproduce extracellular polymeric substances (EPS), which will enhance copper ion release, causing more rapid death on copper. Indeed, all 13 SCVs tested were more rapidly killed than wild-types on the surfaces of both pure copper and brass (63.5 % Cu). Next, using the non-pathogenic Pseudomonas fluorescens SBW25 as a model, we examined the roles of specific cell surface components in contact killing, including EPS, LPS, capsule, flagella and pili. We also subjected P. fluorescens SBW25 to daily serial passage of sub-lethal conditions on brass. After 100 transfers, there was a slight increase of survival rate, but ~97 % of cells can still be killed within 60 min on brass. Together, our data implicate that the rate of contact killing on copper is largely determined by the cell surface components, and bacteria have limited ability to evolve resistance to metallic copper.
在医院设施中,将具有自消毒功能的铜表面应用于常见的接触部位是预防医疗相关感染的一种新兴策略。这是因为细菌病原体在铜表面会迅速被杀死,这一过程被称为接触杀灭。然而,接触杀灭的机制尚未完全了解,细菌病原体产生耐药性的可能性也很少被探究。在此,我们假设细菌主要是被有毒铜离子的突然释放所杀死,这种释放源于细菌细胞表面成分与金属铜之间的化学反应。为了验证这一点,我们分离并鉴定了源自铜绿假单胞菌和金黄色葡萄球菌的小菌落变体(SCV)。SCV会过量产生胞外聚合物(EPS),这会增强铜离子的释放,从而使细菌在铜表面更快死亡。事实上,在纯铜和黄铜(含63.5%铜)表面测试的所有13种SCV都比野生型更快被杀死。接下来,我们以非致病性荧光假单胞菌SBW25为模型,研究了特定细胞表面成分在接触杀灭中的作用,包括EPS、脂多糖、荚膜、鞭毛和菌毛。我们还让荧光假单胞菌SBW25在黄铜表面每日经历亚致死条件的连续传代。经过100次传代后,存活率略有增加,但在黄铜表面仍有约97%的细胞能在60分钟内被杀死。总之,我们的数据表明,在铜表面的接触杀灭速率很大程度上由细胞表面成分决定,并且细菌对金属铜产生耐药性的能力有限。