School of Energy and Chemical Engineering, Ulsan National Institute of Science and Technology (UNIST) , Ulsan 689-798, Korea.
Department of Materials Science and Engineering, National Tsing Hua University , Hsinchu, 30013, Taiwan ROC.
ACS Appl Mater Interfaces. 2016 Oct 5;8(39):26105-26111. doi: 10.1021/acsami.6b06580. Epub 2016 Sep 23.
Development of broadband photodetectors is of great importance for applications in high-capacity optical communication, night vision, and biomedical imaging systems. While heterostructured photodetectors can expand light detection range, fabrication of heterostructures via epitaxial growth or wafer bonding still faces significant challenges because of problems such as lattice and thermal mismatches. Here, a transfer printing technique is used for the heterogeneous integration of InGaAs nanomembranes on silicon semiconductors and thus the formation of van der Waals heterojunction photodiodes, which can enhance the spectral response and photoresponsivity of Si photodiodes. Transfer-printed InGaAs nanomembrane/Si heterojunction photodiode exhibits a high rectification ratio (7.73 × 10 at ±3 V) and low leakage current (7.44 × 10 A/cm at -3 V) in a dark state. In particular, the photodiode shows high photoresponsivities (7.52 and 2.2 A W at a reverse bias of -3 V and zero bias, respectively) in the broadband spectral range (400-1250 nm) and fast rise-fall response times (13-16 ms), demonstrating broadband and fast photodetection capabilities. The suggested III-V/Si van der Waals heterostructures can be a robust platform for the fabrication of high-performance on-chip photodetectors compatible with Si integrated optical chips.
宽带光电探测器的发展对于高容量光通信、夜视和生物医学成像系统等应用具有重要意义。虽然异质结构光电探测器可以扩展光探测范围,但通过外延生长或晶圆键合来制造异质结构仍然面临着晶格和热失配等问题的重大挑战。在这里,采用转移打印技术实现了 InGaAs 纳米膜在硅半导体上的异质集成,从而形成了范德华异质结光电二极管,这可以提高 Si 光电二极管的光谱响应和光响应率。转移打印的 InGaAs 纳米膜/Si 异质结光电二极管在暗态下具有高整流比(±3 V 时为 7.73×10 )和低漏电流(-3 V 时为 7.44×10 A/cm )。特别是,该光电二极管在宽带光谱范围(400-1250nm)内具有高光响应率(反向偏压为-3V 时为 7.52 和零偏压时为 2.2 A W )和快速上升下降响应时间(13-16ms),表现出宽带和快速的光电探测能力。所提出的 III-V/Si 范德华异质结构可以成为制造与 Si 集成光芯片兼容的高性能片上光电探测器的稳健平台。