Tommasi Alessio, Cocuzza Matteo, Perrone Denis, Pirri Candido Fabrizio, Mosca Roberto, Villani Marco, Delmonte Nicola, Zappettini Andrea, Calestani Davide, Marasso Simone Luigi
χlab-Materials and Microsystems Laboratory, Department of Applied Science and Technology, Politecnico di Torino-Via Lungo Piazza d'Armi 6, 10034 Chivasso, Turin, Italy.
Istituto Materiali per Elettronica e Magnetismo, Consiglio Nazionale delle Ricerche, Parco Area delle Scienze, 37a, 43124 Parma, Italy.
Sensors (Basel). 2016 Dec 30;17(1):62. doi: 10.3390/s17010062.
In the sensors field the active sensing material frequently needs a controlled temperature in order to work properly. In microsystems technology, micro-machined hotplates represent a platform consisting of a thin suspended membrane where the sensing material can be deposited, usually integrating electrical stimuli and temperature readout. The micro-hotplate ensures a series of advantages such as miniaturized size, fast response, high sensitivity, low power consumption and selectivity for chemical sensing. This work compares the coplanar and the buried approach for the micro-hotplate heaters design with the aim to optimize the fabrication process and to propose a guideline for the choice of the suitable design with respect to the applications. In particular, robust Finite Element Method (FEM) models are set up in order to predict the electrical and thermal behavior of the micro-hotplates. The multiphysics approach used for the simulation allows to match as close as possible the actual device to the predictive model: geometries, materials, physics have been carefully linked to the fabricated devices to obtain the best possible accuracy. The materials involved in the fabrication process are accurately selected in order to improve the yield of the process and the performance of the devices. The fabricated micro-hotplates are able to warm the active region up to 400 °C (with a corresponding power consumption equal to 250 mW @ 400 °C) with a uniform temperature distribution in the buried micro-hotplate and a controlled temperature gradient in the coplanar one. A response time of about 70 ms was obtained on the virtual model, which perfectly agrees with the one measured on the fabricated device. Besides morphological, electrical and thermal characterizations, this work includes reliability tests in static and dynamic modes.
在传感器领域,有源传感材料通常需要在受控温度下才能正常工作。在微系统技术中,微机械热板是一个由薄悬浮膜组成的平台,传感材料可以沉积在该平台上,通常集成了电刺激和温度读出功能。微热板具有一系列优点,如尺寸小型化、响应速度快、灵敏度高、功耗低以及对化学传感具有选择性。这项工作比较了微热板加热器设计的共面和埋入式方法,旨在优化制造工艺,并针对应用提出选择合适设计的指导原则。特别是,建立了稳健的有限元方法(FEM)模型,以预测微热板的电学和热学行为。用于模拟的多物理场方法允许使实际器件尽可能接近预测模型:几何形状、材料、物理特性已与制造的器件仔细关联,以获得尽可能高的精度。为了提高工艺成品率和器件性能,精确选择了制造过程中涉及的材料。制造的微热板能够将有源区域加热到400°C(在400°C时相应的功耗等于250 mW),埋入式微热板中的温度分布均匀,共面式微热板中的温度梯度可控。在虚拟模型上获得了约70 ms的响应时间,这与在制造的器件上测量的结果完全一致。除了形态学、电学和热学表征外,这项工作还包括静态和动态模式下的可靠性测试。