低温烧结复合颗粒混合分散体制备铜膜的分解和有机残留物对电阻率的影响。
Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions.
机构信息
Division of Materials Science and Engineering, Faculty of Engineering, Hokkaido University, Kita 13 Nishi 8, Kita-ku, Sapporo, Hokkaido 060-8628, Japan.
Department of Materials and Environment Engineering, National Institute of Technology, Sendai College, 48 Nodayama, Medeshima-Shiote, Natori-shi, Miyagi 981-1239, Japan.
出版信息
Sci Rep. 2017 Mar 24;7:45150. doi: 10.1038/srep45150.
Mixtures of a copper complex and copper fine particles as copper-based metal-organic decomposition (MOD) dispersions have been demonstrated to be effective for low-temperature sintering of conductive copper film. However, the copper particle size effect on decomposition process of the dispersion during heating and the effect of organic residues on the resistivity have not been studied. In this study, the decomposition process of dispersions containing mixtures of a copper complex and copper particles with various sizes was studied. The effect of organic residues on the resistivity was also studied using thermogravimetric analysis. In addition, the choice of copper salts in the copper complex was also discussed. In this work, a low-resistivity sintered copper film (7 × 10 Ω·m) at a temperature as low as 100 °C was achieved without using any reductive gas.
铜配合物和铜纳米粒子的混合物作为铜基金属有机分解（MOD）分散体已被证明可有效用于低温烧结导电铜膜。然而，在加热过程中分散体中铜颗粒尺寸对分解过程的影响以及有机残留物对电阻率的影响尚未得到研究。在本研究中，研究了含有铜配合物和不同粒径铜颗粒混合物的分散体的分解过程。还使用热重分析研究了有机残留物对电阻率的影响。此外，还讨论了铜配合物中铜盐的选择。在这项工作中，无需使用任何还原气体，在低至 100°C 的温度下即可获得低电阻率烧结铜膜（7×10Ω·m）。
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