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通过在各种表面上采用通用的干式层压封装方法构建低滞后碳纳米管晶体管。

Low Hysteresis Carbon Nanotube Transistors Constructed via a General Dry-Laminating Encapsulation Method on Diverse Surfaces.

机构信息

Advanced Nano-materials Division, Key Laboratory of Nano-Devices and Applications, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences , Suzhou 215123, China.

University of Chinese Academy of Sciences , Beijing 100049, China.

出版信息

ACS Appl Mater Interfaces. 2017 Apr 26;9(16):14292-14300. doi: 10.1021/acsami.7b02684. Epub 2017 Apr 11.

DOI:10.1021/acsami.7b02684
PMID:28375600
Abstract

Electrical hysteresis in carbon nanotube thin-film transistor (CNTTFT) due to surface adsorption of HO/O is a severe obstacle for practical applications. The conventional encapsulation methods based on vacuum-deposited inorganic materials or wet-coated organic materials have some limitations. In this work, we develop a general and highly efficient dry-laminating encapsulation method to reduce the hysteresis of CNTTFTs, which may simultaneously realize the construction and encapsulation of CNTTFT. Furthermore, by virtue of dry procedure and wide compatibility of PMMA, this method is suitable for the construction of CNTTFT on diverse surface including both inorganic and organic dielectric materials. Significantly, the dry-encapsulated CNTTFT exhibits very low or even negligible hysteresis with good repeatability and air stability, which is greatly superior to the nonencapsulated and wet-encapsulated CNTTFT with spin-coated PMMA. The dry-laminating encapsulation strategy, a kind of technological innovation, resolves a significant problem of CNTTFT and therefore will be promising in facile transferring and packaging the CNT films for high-performance optoelectronic devices.

摘要

由于表面吸附的 HO/O 导致碳纳米管薄膜晶体管 (CNTTFT) 中的电滞后现象是实际应用的严重障碍。基于真空沉积无机材料或湿涂有机材料的传统封装方法存在一些局限性。在这项工作中,我们开发了一种通用且高效的干法层压封装方法来降低 CNTTFT 的滞后现象,这可能同时实现 CNTTFT 的构建和封装。此外,由于 PMMA 的干法程序和广泛的兼容性,该方法适用于包括无机和有机介电材料在内的各种表面上的 CNTTFT 的构建。显著地,干燥封装的 CNTTFT 表现出非常低甚至可以忽略不计的滞后现象,具有良好的可重复性和空气稳定性,这大大优于具有旋涂 PMMA 的未封装和湿封装的 CNTTFT。这种干法层压封装策略是一种技术创新,解决了 CNTTFT 的一个重大问题,因此有望在简便地转移和封装 CNT 薄膜以用于高性能光电设备方面具有广阔的前景。

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