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厘米级 MoWSe 合金膜在多功能衬底上的沉积及其在高性能光电探测器中的应用。

Centimeter-Scale Deposition of MoWSe Alloy Film for High-Performance Photodetectors on Versatile Substrates.

机构信息

State Key Laboratory of Optoelectronic Materials and Technologies, Nanotechnology Research Center, School of Materials Science & Engineering, Sun Yat-sen University , Guangzhou 510275, Guangdong, P. R. China.

出版信息

ACS Appl Mater Interfaces. 2017 May 3;9(17):14920-14928. doi: 10.1021/acsami.7b02166. Epub 2017 Apr 21.

DOI:10.1021/acsami.7b02166
PMID:28406009
Abstract

Because of their great potential for academic investigation and practical application in next-generation optoelectronic devices, ternary layered semiconductors have attracted considerable attention in recent years. Similar to the applications of traditional layered materials, practical applications of ternary layered semiconductor alloys require the synthesis of large-area samples. Here, we report the preparation of centimeter-scale and high-quality MoWSe alloy films on both a rigid SiO/Si substrate and a flexible polyimide (PI) substrate. Then, photodetectors based on these alloy films are fabricated, which are capable of conducting broad-band photodetection from ultraviolet to near-infrared region (370-808 nm) with high performance. The photodetector on SiO/Si substrates demonstrates a high responsivity (R) of 77.1 A/W, an outstanding detectivity (D*) of 1.1 × 10 Jones, and a fast response time of 8.3 ms. These figures-of-merit are much superior to those of the counterparts of binary material-based devices. Moreover, the photodetector on PI substrates also achieves high performance (R = 63.5 A/W, D* = 3.56 × 10 Jones). And no apparent degradation in the device properties is observed even after 100 bending cycles. These results make MoWSe alloy a highly qualified candidate for next-generation optoelectronic applications.

摘要

由于其在下一代光电器件中的学术研究和实际应用方面具有巨大的潜力,三元层状半导体近年来引起了广泛关注。与传统层状材料的应用类似,三元层状半导体合金的实际应用需要合成大面积的样品。在这里,我们报告了在刚性 SiO2/Si 衬底和柔性聚酰亚胺(PI)衬底上制备厘米级和高质量 MoWSe 合金薄膜的方法。然后,基于这些合金薄膜制备了光电探测器,这些探测器能够在从紫外到近红外区域(370-808nm)进行宽带光电探测,性能优异。在 SiO2/Si 衬底上的光电探测器表现出 77.1A/W 的高响应率(R)、1.1×10-10 琼斯的出色探测率(D*)和 8.3ms 的快速响应时间。这些性能指标远优于基于二元材料器件的同类产品。此外,PI 衬底上的光电探测器也实现了高性能(R=63.5A/W,D*=3.56×10-10 琼斯)。即使经过 100 次弯曲循环,器件性能也没有明显下降。这些结果使得 MoWSe 合金成为下一代光电器件应用的极具潜力的候选材料。

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