添加鱼骨状碳化硅提高聚合物复合材料的热导率

Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide.

作者信息

Xia Juncheng, Qin Yue, Wei Xianzhe, Li Linhong, Li Maohua, Kong Xiangdong, Xiong Shaoyang, Cai Tao, Dai Wen, Lin Cheng-Te, Jiang Nan, Fang Shuangquan, Yi Jian, Yu Jinhong

机构信息

School of Mechanical Engineering, Yangzhou University, Yangzhou 225009, China.

Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China.

出版信息

Nanomaterials (Basel). 2021 Oct 28;11(11):2891. doi: 10.3390/nano11112891.

DOI:10.3390/nano11112891

PMID:34835656

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8620080/

Abstract

The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m K, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.

摘要

芯片技术的快速发展对高导热材料提出了更高的要求。在这项工作中，一种新型的鱼骨状碳化硅（SiC）材料被用作聚偏氟乙烯（PVDF）基体中的填料。通过简单的混合方法成功制备了不同负载量的碳化硅/聚偏氟乙烯（SiC/PVDF）复合材料。SiC/PVDF复合材料的热导率达到0.92 W m K，比纯聚合物高出470%。结果表明，使用具有新结构的填料构建导热网络是提高PVDF热导率的有效方法。这项工作为其在电子封装领域的进一步应用提供了新思路。