Department of Nanoscience and Nanoengineering, Waseda University, 3-4-1 Okubo Shinjuku-ku, Tokyo 169-8555, Japan.
National Institute for Material Science (NIMS), 1-1 Namiki, Tsukuba, Ibaraki 305-0044, Japan.
Mater Sci Eng C Mater Biol Appl. 2017 Oct 1;79:860-865. doi: 10.1016/j.msec.2017.05.058. Epub 2017 May 11.
Direct heterogeneous bonding between polyether ether ketone (PEEK) and Pt was realized at the temperatures lower than 150°C. In order to create sufficient bondability to diverse materials, the surface was modified by vacuum ultraviolet (VUV) irradiation, which formed hydrate bridges. For comparison, direct bonding between surfaces atomically cleaned via Ar fast atom bombardment (FAB) was conducted in a vacuum. The VUV irradiation was found to be effective for creating an ultrathin hydrate bridge layer from the residual water molecules in the chamber. Tight bonds were formed through dehydration of the hydrate bridges by heating at 150°C, which also contributed to enhancing interdiffusion across the interface. The VUV-modified surfaces showed bondability as good as that of the FAB-treated surfaces, and the VUV-modified samples had shear strengths at the same level as those of FAB-treated surfaces. This technology will be of practical use in the packaging of lightweight, flexible biomedical devices.
在低于 150°C 的温度下实现了聚醚醚酮（PEEK）与 Pt 之间的直接非均相键合。为了在各种材料上创造足够的键合能力，通过真空紫外（VUV）辐照对表面进行改性，形成水合桥。为了进行比较，在真空中通过氩快原子轰击（FAB）对原子清洁的表面进行了直接键合。发现 VUV 辐照对于从腔室中的残留水分子形成超薄的水合桥层是有效的。通过在 150°C 加热使水合桥脱水，形成紧密的键合，这也有助于增强界面处的互扩散。VUV 改性表面表现出与 FAB 处理表面相当的键合能力，并且 VUV 改性样品的剪切强度与 FAB 处理表面的水平相当。这项技术将在轻量级、灵活的生物医学设备的封装中具有实际用途。
