Tao N, Li X L, Sun J G
Department of Physics, Capital Normal University, Beijing Key Lab for Terahertz Spectroscopy and Imaging, Key Lab of Terahertz Optoelectronics, Ministry of Education, and Beijing Advanced Innovation Center for Imaging Technology, Beijing 100048, China.
School of Optoelectronics, Beijing Institute of Technology, Beijing 100081, China.
Rev Sci Instrum. 2017 Jun;88(6):064903. doi: 10.1063/1.4985633.
Thermal properties are important for material applications involved with temperature. Although many measurement methods are available, they may not be convenient to use or have not been demonstrated suitable for testing of a wide range of materials. To address this issue, we developed a new method for the nondestructive measurement of the thermal effusivity of bulk materials with uniform property. This method is based on the pulsed thermal imaging-multilayer analysis (PTI-MLA) method that has been commonly used for testing of coating materials. Because the test sample for PTI-MLA has to be in a two-layer configuration, we have found a commonly used commercial tape to construct such test samples with the tape as the first-layer material and the bulk material as the substrate. This method was evaluated for testing of six selected solid materials with a wide range of thermal properties covering most engineering materials. To determine both thermal conductivity and heat capacity, we also measured the thermal diffusivity of these six materials by the well-established flash method using the same experimental instruments with a different system setup. This paper provides a description of these methods, presents detailed experimental tests and data analyses, and discusses measurement results and their comparison with literature values.
