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通过室温氢氟酸蚀刻改善树脂与氧化锆的粘结

Improved Resin-Zirconia Bonding by Room Temperature Hydrofluoric Acid Etching.

作者信息

Lee Mun-Hwan, Son Jun Sik, Kim Kyo-Han, Kwon Tae-Yub

机构信息

Department of Medical & Biological Engineering, Graduate School, Kyungpook National University, 2-188-1 Samduk-dong, Jung-gu, Daegu 700-412, Korea.

Korea Textile Development Institute, 1083 Jungri-dong, Seo-gu, Daegu 703-712, Korea.

出版信息

Materials (Basel). 2015 Mar 2;8(3):850-866. doi: 10.3390/ma8030850.

DOI:10.3390/ma8030850
PMID:28787975
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC5455444/
Abstract

This study was conducted to evaluate the shear bond strength of "non-self-adhesive" resin to dental zirconia etched with hydrofluoric acid (HF) at room temperature and to compare it to that of air-abraded zirconia. Sintered zirconia plates were air-abraded (control) or etched with 10%, 20%, or 30% HF for either 5 or 30 min. After cleaning, the surfaces were characterized using various analytical techniques. Three resin cylinders (Duo-Link) were bonded to each treated plate. All bonded specimens were stored in water at 37 °C for 24 h, and then half of them were additionally thermocycled 5000 times prior to the shear bond-strength tests ( = 12). The formation of micro- and nano-porosities on the etched surfaces increased with increasing concentration and application time of the HF solution. The surface wettability of zirconia also increased with increasing surface roughness. Higher concentrations and longer application times of the HF solution produced higher bond-strength values. Infiltration of the resin into the micro- and nano-porosities was observed by scanning electron microscopy. This study suggests that HF slowly etches zirconia ceramic surfaces at room temperature, thereby improving the resin-zirconia bond strength by the formation of retentive sites.

摘要

本研究旨在评估“非自粘性”树脂与在室温下用氢氟酸(HF)蚀刻的牙科氧化锆之间的剪切粘结强度,并将其与空气研磨氧化锆的剪切粘结强度进行比较。将烧结氧化锆板进行空气研磨(对照)或用10%、20%或30%的HF蚀刻5分钟或30分钟。清洗后,使用各种分析技术对表面进行表征。将三个树脂圆柱体(Duo-Link)粘结到每个处理过的板上。所有粘结试样在37℃的水中储存24小时,然后其中一半在进行剪切粘结强度测试之前额外进行5000次热循环(n = 12)。蚀刻表面上微孔和纳米孔的形成随着HF溶液浓度和作用时间的增加而增加。氧化锆的表面润湿性也随着表面粗糙度的增加而增加。HF溶液浓度越高、作用时间越长,粘结强度值越高。通过扫描电子显微镜观察到树脂渗入微孔和纳米孔中。本研究表明,HF在室温下缓慢蚀刻氧化锆陶瓷表面,从而通过形成固位部位提高树脂与氧化锆的粘结强度。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/7a629fdd4e9b/materials-08-00850-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/80f4ed42fd15/materials-08-00850-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/3d933581b920/materials-08-00850-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/a8715327a0de/materials-08-00850-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/efffd9632a0e/materials-08-00850-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/b12be0f70b50/materials-08-00850-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/ce0eb02c4ea9/materials-08-00850-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/d43dd7a66578/materials-08-00850-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/7a629fdd4e9b/materials-08-00850-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/80f4ed42fd15/materials-08-00850-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/3d933581b920/materials-08-00850-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/a8715327a0de/materials-08-00850-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/efffd9632a0e/materials-08-00850-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/b12be0f70b50/materials-08-00850-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/ce0eb02c4ea9/materials-08-00850-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/d43dd7a66578/materials-08-00850-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a2a4/5455444/7a629fdd4e9b/materials-08-00850-g008.jpg

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