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单晶硅中压痕诱发弹出的随机性和统计规律

Randomness and Statistical Laws of Indentation-Induced Pop-Out in Single Crystal Silicon.

作者信息

Huang Hu, Zhao Hongwei, Shi Chengli, Zhang Lin, Wan Shunguang, Geng Chunyang

机构信息

College of Mechanical Science & Engineering, Jilin University, Renmin Street 5988, Changchun 130025, China.

出版信息

Materials (Basel). 2013 Apr 12;6(4):1496-1505. doi: 10.3390/ma6041496.

DOI:10.3390/ma6041496
PMID:28809223
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC5452323/
Abstract

Randomness and discreteness for appearance of pop-out of the single crystal silicon with a (100) orientation were studied by a self-made indentation device. For a given maximum penetration load, the load for appearance of pop-out fluctuates in a relatively large range, which makes it hard to study the effect of the loading/unloading rate on the load . Experimental results with different maximum penetration loads indicate that the critical penetration load for appearance of pop-out is in the range of 15 mN20 mN for the current used single crystal silicon. For a given maximum penetration load, the load for appearance of pop-out seems random and discrete, but in the point of statistics, it has an obviously increasing trend with increase of the maximum penetration load and also the fraction / approximately keeps in the range of 0.20.5 for different maximum penetration loads changing from 15 mN to 150 mN.

摘要

利用自制的压痕装置研究了具有(100)取向的单晶硅弹出现象的随机性和离散性。对于给定的最大压入载荷,弹出出现时的载荷在相对较大的范围内波动,这使得研究加载/卸载速率对该载荷的影响变得困难。不同最大压入载荷的实验结果表明,对于当前使用的单晶硅,弹出出现时的临界压入载荷在15 mN至20 mN范围内。对于给定的最大压入载荷,弹出出现时的载荷似乎是随机和离散的,但从统计角度来看,它随着最大压入载荷的增加有明显的上升趋势,并且对于从15 mN到150 mN变化的不同最大压入载荷,分数/大致保持在0.2至0.5的范围内。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/9eb101fba480/materials-06-01496-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/b2c26b5bbbd7/materials-06-01496-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/04c15d0f1361/materials-06-01496-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/3664e761d503/materials-06-01496-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/da784a88f6a3/materials-06-01496-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/3211b77c8a46/materials-06-01496-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/5a91d9f7fe81/materials-06-01496-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/9eb101fba480/materials-06-01496-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/b2c26b5bbbd7/materials-06-01496-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/04c15d0f1361/materials-06-01496-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/3664e761d503/materials-06-01496-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/da784a88f6a3/materials-06-01496-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/3211b77c8a46/materials-06-01496-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/5a91d9f7fe81/materials-06-01496-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6fd3/5452323/9eb101fba480/materials-06-01496-g007.jpg

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本文引用的文献

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Experimental research on a modular miniaturization nanoindentation device.模块化小型化纳米压痕装置的实验研究
Rev Sci Instrum. 2011 Sep;82(9):095101. doi: 10.1063/1.3632980.
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Evolution of metastable phases in silicon during nanoindentation: mechanism analysis and experimental verification.纳米压痕过程中硅中亚稳相的演变:机理分析与实验验证
Nanotechnology. 2009 Jul 29;20(30):305705. doi: 10.1088/0957-4484/20/30/305705. Epub 2009 Jul 8.
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Nanoindentation-induced phase transformations in silicon at elevated temperatures.高温下纳米压痕诱导硅中的相变。
未掺杂n型砷化镓在Berkovich压头和平头压头压痕下的力学行为
Materials (Basel). 2019 Apr 11;12(7):1192. doi: 10.3390/ma12071192.
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Investigations of Phase Transformation in Monocrystalline Silicon at Low Temperatures via Nanoindentation.通过纳米压痕技术研究低温下单晶硅的相变。
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