Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences , Shenyang 110016, China.
University of Chinese Academy of Sciences , Shenyang 110016, China.
ACS Appl Mater Interfaces. 2018 Jan 17;10(2):1743-1751. doi: 10.1021/acsami.7b16356. Epub 2018 Jan 2.
Porous modification is a general approach to endowing the rigid inorganic thermoelectric (TE) materials with considerable flexibility, however, by which the TE performances are severely sacrificed. Thus, there remains an ongoing struggle against the trade-off between TE properties and flexibility. Herein, we develop a novel strategy to combine BiTe thick film with ubiquitous cellulose fibers (CFs) via an unbalanced magnetron sputtering technique. Owing to the nano-micro hierarchical porous structures and the excellent resistance to crack propagation of the BiTe/CF architectures, the obtained sample with a nominal BiTe deposition thickness of tens of micrometers exhibits excellent mechanically reliable flexibility, of which the bending deformation radius could be as small as a few millimeters. Furthermore, the BiTe/CF with rational internal resistance and tailorable shapes and dimensions are successfully fabricated for practical use in TE devices. Enhanced Seebeck coefficients are observed in the BiTe/CF as compared to the dense BiTe films, and the lattice thermal conductivity is remarkably reduced due to the strong phonon scattering effect. As a result, the TE figure of merit, ZT, is achieved as high as ∼0.38 at 473 K, which competes with the best flexible TEs and can be further improved by optimizing the carrier concentrations. We believe this developed technique not only opens up a new window to engineer flexible TE materials for practical applications but also promotes the robust development of the fields, such as paper-based flexible electronics and thin-film electronics.
多孔改性是赋予刚性无机热电(TE)材料相当柔韧性的一种通用方法,但这会严重牺牲 TE 性能。因此,人们一直在努力解决 TE 性能和柔韧性之间的权衡问题。在此,我们开发了一种通过非平衡磁控溅射技术将 BiTe 厚膜与无处不在的纤维素纤维(CF)结合的新策略。由于 BiTe/CF 结构具有纳米-微分级多孔结构和出色的抗裂纹扩展能力,因此获得的具有数十微米标称 BiTe 沉积厚度的样品具有出色的机械可靠柔韧性,其弯曲变形半径可小至几毫米。此外,成功制造出具有合理内阻和可定制形状和尺寸的 BiTe/CF,可用于实际的 TE 器件。与致密的 BiTe 薄膜相比,BiTe/CF 表现出增强的 Seebeck 系数,并且由于声子散射效应,晶格热导率显着降低。结果,在 473 K 时,TE 品质因数 ZT 高达约 0.38,可与最佳的柔性 TE 相媲美,并可通过优化载流子浓度进一步提高。我们相信,这项开发的技术不仅为实际应用中设计柔性 TE 材料开辟了新的途径,而且还促进了纸基柔性电子和薄膜电子等领域的蓬勃发展。