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具有增强热导率的氮化铝/环氧树脂复合材料的研制

Development of AlN/Epoxy Composites with Enhanced Thermal Conductivity.

作者信息

Xu Yonggang, Yang Chi, Li Jun, Mao Xiaojian, Zhang Hailong, Hu Song, Wang Shiwei

机构信息

Key Laboratory of Transparent Opto-Functional Inorganic Materials, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China.

University of Chinese Academy of Sciences, Beijing 100049, China.

出版信息

Materials (Basel). 2017 Dec 18;10(12):1442. doi: 10.3390/ma10121442.

DOI:10.3390/ma10121442
PMID:29258277
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC5744377/
Abstract

AlN/epoxy composites with high thermal conductivity were successfully prepared by infiltrating epoxy into AlN porous ceramics which were fabricated by gelcasting of foaming method. The microstructure, mechanical, and thermal properties of the resulting composites were investigated. The compressive strengths of the AlN/epoxy composites were enhanced compared with the pure epoxy. The AlN/epoxy composites demonstrate much higher thermal conductivity, up to 19.0 W/(m·K), compared with those by the traditional particles filling method, because of continuous thermal channels formed by the walls and struts of AlN porous ceramics. This study demonstrates a potential route to manufacture epoxy-based composites with extremely high thermal conductivity.

摘要

通过将环氧树脂渗入采用发泡法凝胶注模制备的AlN多孔陶瓷中,成功制备了具有高导热性的AlN/环氧树脂复合材料。研究了所得复合材料的微观结构、力学性能和热性能。与纯环氧树脂相比,AlN/环氧树脂复合材料的抗压强度有所提高。由于AlN多孔陶瓷的壁和支柱形成了连续的热通道,AlN/环氧树脂复合材料表现出比传统颗粒填充法制备的复合材料高得多的导热率,高达19.0W/(m·K)。本研究展示了一条制备具有极高导热率的环氧树脂基复合材料的潜在途径。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/9cb179d8edc3/materials-10-01442-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/31299d5f65b6/materials-10-01442-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/193e4bdd63a7/materials-10-01442-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/86639bd67931/materials-10-01442-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/564d4d8ae928/materials-10-01442-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/0733bfd768d6/materials-10-01442-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/fd84de7ac81e/materials-10-01442-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/9cb179d8edc3/materials-10-01442-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/31299d5f65b6/materials-10-01442-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/193e4bdd63a7/materials-10-01442-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/86639bd67931/materials-10-01442-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/564d4d8ae928/materials-10-01442-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/0733bfd768d6/materials-10-01442-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/fd84de7ac81e/materials-10-01442-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ecb9/5744377/9cb179d8edc3/materials-10-01442-g007.jpg

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