Skjønsfjell Eirik T B, Kleiven David, Patil Nilesh, Chushkin Yuriy, Zontone Federico, Gibaud Alain, Breiby Dag W
J Opt Soc Am A Opt Image Sci Vis. 2018 Jan 1;35(1):A7-A17. doi: 10.1364/JOSAA.35.0000A7.
Coherent x-ray diffraction imaging (CXDI) is becoming an important 3D quantitative microscopy technique, allowing structural investigation of a wide range of delicate mesoscale samples that cannot be imaged by other techniques like electron microscopy. Here we report high-resolution 3D CXDI performed on spherical microcomposites consisting of a polymer core coated with a triple layer of nickel-gold-silica. These composites are of high interest to the microelectronics industry, where they are applied in conducting adhesives as fine-pitch electrical contacts-which requires an exceptional degree of uniformity and reproducibility. Experimental techniques that can assess the state of the composites non-destructively, preferably also while embedded in electronic chips, are thus in high demand. We demonstrate that using CXDI, all four different material components of the composite could be identified, with radii matching well to the nominal specifications of the manufacturer. Moreover, CXDI provided detailed maps of layer thicknesses, roughnesses, and defects such as holes, thus also facilitating cross-layer correlations. The side length of the voxels in the reconstruction, given by the experimental geometry, was 16 nm. The effective resolution enabled resolving even the thinnest coating layer of ∼20 nm nominal width. We discuss critically the influence of the weak phase approximation and the projection approximation on the reconstructed electron density estimates, demonstrating that the latter has to be employed. We conclude that CXDI has excellent potential as a metrology tool for microscale composites.
相干X射线衍射成像(CXDI)正成为一种重要的三维定量显微镜技术,可用于对多种精细的中尺度样品进行结构研究,而这些样品无法用电子显微镜等其他技术成像。在此,我们报告了对由聚合物核包覆镍 - 金 - 二氧化硅三层组成的球形微复合材料进行的高分辨率三维CXDI。这些复合材料在微电子行业备受关注,在其中用作细间距电触点的导电粘合剂,这需要极高的均匀性和可重复性。因此,迫切需要能够无损评估复合材料状态的实验技术,最好是在其嵌入电子芯片时也能进行评估。我们证明,使用CXDI可以识别复合材料的所有四种不同材料成分,其半径与制造商的标称规格匹配良好。此外,CXDI提供了层厚度、粗糙度以及诸如孔洞等缺陷的详细图谱,从而也便于进行跨层关联。由实验几何条件确定的重建体素边长为16纳米。有效分辨率甚至能够分辨出标称宽度约为20纳米的最薄涂层。我们批判性地讨论了弱相位近似和投影近似对重建电子密度估计的影响,证明必须采用后者。我们得出结论,CXDI作为微尺度复合材料的计量工具具有出色的潜力。