Li Z L, Dong H J, Song X G, Zhao H Y, Tian H, Liu J H, Feng J C, Yan J C
Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China.
Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
Ultrason Sonochem. 2018 Apr;42:403-410. doi: 10.1016/j.ultsonch.2017.12.005. Epub 2017 Dec 5.
Homogeneous (Cu, Ni)Sn intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni)Sn and minor CuSn IMCs, and the grain morphology of (Cu, Ni)Sn IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni)Sn IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa).
通过超声诱导瞬态液相（TLP）焊接工艺，在不对称的Ni/Sn/Cu体系中快速形成了均匀的（Cu，Ni）Sn金属间化合物（IMC）接头。在传统的TLP焊接工艺中，Ni/Sn/Cu体系中形成的金属间接头由主要的（Cu，Ni）Sn和次要的CuSn IMC组成，并且（Cu，Ni）Sn IMC的晶粒形态从Ni侧到Cu侧随后呈现出细小圆形、针状和粗大圆形的形状，这与接头中Ni浓度梯度高度一致。然而，在超声诱导的TLP焊接工艺中，Ni/Sn/Cu体系中形成的金属间接头仅由（Cu，Ni）Sn IMC组成，其呈现出均匀的圆形晶粒形态，且Ni浓度梯度显著变窄。超声诱导的均匀金属间接头比传统的非均匀金属间接头具有更高的剪切强度（61.6MPa）（49.8MPa）。
