Jones Thomas D A, Bernassau Anne, Flynn David, Price Dennis, Beadel Matthew, Desmulliez Marc P Y
Heriot-Watt University, Research Institute of Signals, Sensors and Systems, School of Engineering and Physical Sciences, Edinburgh, UK; Merlin Circuit Technology Ltd, Deeside, UK.
Heriot-Watt University, Research Institute of Signals, Sensors and Systems, School of Engineering and Physical Sciences, Edinburgh, UK.
Ultrason Sonochem. 2018 Apr;42:434-444. doi: 10.1016/j.ultsonch.2017.12.004. Epub 2017 Dec 5.
In this research experimental and simulated analysis investigates the influence of megasonic (MS; 1 ± 0.05 MHz) acoustic-assisted electroplating techniques, with respect to the fabrication of through-hole via (THV) and blind-via (BV) interconnects for the Printed Circuit Board (PCB) industry. MS plating of copper down THV and BV interconnects was shown to produce measurable benefits such as increased connectivity throughout a PCB and cost savings. More specifically, a 700% increase of copper plating rate was demonstrated for THVs of 175 µm diameter and depth-to-width aspect ratio (ar) of 5.7:1, compared with electrodeposition under no-agitation conditions. For BVs, a 60% average increase in copper thickness deposition in 150 µm and 200 µm, ar 1:1, was demonstrated against plating under standard manufacturing conditions including bubble agitation and panel movement. Finite element modelling simulations of acoustic scattering revealed 1st harmonic influence for plating rate enhancement.
在本研究中，通过实验和模拟分析，研究了兆声波（MS；1±0.05MHz）声辅助电镀技术对印刷电路板（PCB）行业通孔（THV）和盲孔（BV）互连制造的影响。结果表明，对THV和BV互连进行MS镀铜可产生显著效益，如提高整个PCB的连通性并节省成本。具体而言，与无搅拌条件下的电沉积相比，直径为175µm、深宽比（ar）为5.7:1的THV的镀铜速率提高了700%。对于BV，在包括气泡搅拌和板移动的标准制造条件下进行电镀时，150µm和200µm、ar为1:1的BV的铜厚度沉积平均增加了60%。声散射的有限元建模模拟揭示了对镀速提高的一阶谐波影响。
