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脑皮层内硅微电极植入物对血脑屏障的破坏作用。

Blood brain barrier (BBB)-disruption in intracortical silicon microelectrode implants.

机构信息

Department of Biomedical Engineering, University of Miami, FL, USA.

Department of Biology, University of Miami, FL, USA.

出版信息

Biomaterials. 2018 May;164:1-10. doi: 10.1016/j.biomaterials.2018.02.036. Epub 2018 Feb 20.

Abstract

Chronically implanted microelectrodes in the neural tissue elicit inflammatory responses that are time varying and have been shown to depend on multiple factors. Among these factors, blood brain barrier (BBB)-disruption has been hypothesized as one of the dominant factors resulting in electrode failure. A series of events that includes BBB and cell-membrane disruption occurs during electrode implantation that triggers multiple biochemical cascades responsible for microglial and astroglial activation, hemorrhage, edema, and release of pro-inflammatory neurotoxic cytokines that causes neuronal degeneration and dysfunction. Typically, microwire arrays and silicon probes are inserted slowly into the neural tissue whereas the silicon Utah MEAs (UMEA) are inserted at a high speed using a pneumatic inserter. In this work, we report the sequelae of electrode-implant induced cortical injury at various acute time points in UMEAs implanted in the brain tissue by quantifying the expression profile for key genes mediating the inflammatory response and tight junction (TJ) and adherens junction (AJ) proteins that form the BBB and are critical to the functioning of the BBB. Our results indicated upregulation of most pro-inflammatory genes relative to naïve controls for all time points. Expression levels for the genes that form the TJ and AJ were downregulated suggestive of BBB-dysfunction. Moreover, there was no significant difference between stab and implant groups suggesting the effects of UMEA insertion-related trauma in the brain tissue. Our results provide an insight into the physiological events related to neuroinflammation and BBB-disruption occurring at acute time-points following insertion of UMEAs.

摘要

慢性植入神经组织的微电极会引发炎症反应,这种反应随时间而变化,并已被证明取决于多种因素。在这些因素中,血脑屏障(BBB)破坏被假设为导致电极失效的主要因素之一。在电极植入过程中,会发生一系列包括 BBB 和细胞膜破坏的事件,触发多个生化级联反应,导致小胶质细胞和星形胶质细胞激活、出血、水肿以及促炎神经毒性细胞因子的释放,从而导致神经元变性和功能障碍。通常,微丝阵列和硅探针缓慢插入神经组织,而硅 Utah MEAs(UMEA)则使用气动植入器高速插入。在这项工作中,我们报告了在脑组织中植入 UMEA 后不同急性时间点电极植入引起的皮质损伤的后果,通过定量分析介导炎症反应的关键基因以及形成 BBB 的紧密连接(TJ)和黏附连接(AJ)蛋白的表达谱来评估,这些基因对于 BBB 的功能至关重要。我们的结果表明,与正常对照组相比,所有时间点的大多数促炎基因都上调。TJ 和 AJ 形成基因的表达水平下调,表明 BBB 功能障碍。此外,刺伤组和植入组之间没有显著差异,这表明与 UMEA 插入相关的脑损伤。我们的结果提供了对插入 UMEA 后急性时间点发生的神经炎症和 BBB 破坏相关生理事件的深入了解。

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